Electric signal connecting device and probe assembly and probing device using the same

ABSTRACT

The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric connection created on electric functional elements to be tested for electric connection, and a resin film supporting the vertical probes, and the vertical probes are planted resiliently deformably in a surface of a resin film in a direction along the film surface, and an end of the vertical probes is brought into contact with terminals of electric functional elements to be tested and another end of the vertical probes is brought into contact with terminals of an electric function testing apparatus so that signals may be transmitted and received between the electric functional elements to be tested and the electric function testing apparatus.

BACKGROUND OF INVENTION

1. Field of the Invention

The present invention relates to an electric signal connecting deviceand a probe assembly for use in checking circuits in a plurality ofsemiconductor chips formed on a semiconductor wafer in the process ofproducing LSI and other electronic devices or in checking circuits inliquid crystal and other electronic devices. The present invention isused in the so-called probing test for, for example, measuring theelectric conduction of semiconductor chips en bloc by bringing verticalprobes into contact with circuit terminals (pads) arranged on thesemiconductor chips while they are still in a wafer state.

2. Description of Prior Art

The degree of integration of electronic devices has improved keepingpace with the progress in semiconductor technology, and the areaoccupied by circuit interconnection in each semiconductor chip formed ona semiconductor wafer keeps on increasing. As a result, the number ofcircuit terminals (pads) has increased on each semiconductor chip, andin keeping pace therewith the contraction of pad area, and theminiaturization of pad arrangement due to narrowing of pad pitch areprogressing. At the same time, chip size packing of loading bare chipsin circuit boards without enclosing semiconductor chips into package isbecoming the main stream. For this reason, it becomes necessary by allmeans to check property and determine quality in the wafer state beforedividing it into semiconductor chips.

In particular, an issue arising out of the miniaturization of padarrangement (narrowing of pitch) is that the structure of probe forobtaining electric conductivity by bringing it into contact with thepads of semiconductor chips at the time of electric property tests orcircuit test of electronic devices must be matched to theminiaturization of pad arrangement, and various measuring means are usedto cope with this progress in miniaturization of pad arrangement.

For example, one of such means is one that makes a probe assembly madeby area arranging a plurality of needle probes having a resilientlytransforming part resiliently transforming in response to outside forcesintervene between the pads of semiconductor chips to be tested and thetesting device. As a means of electrically connecting this probeassembly and the test circuit of semiconductor chips, a printed wiringboard called “probe card” is used. A past example of such circuittesting technology involving such a probe is, for example, the inventiondisclosed in the Japanese Patent Disclosure No. 2002-298297 and JapanesePatent Disclosure No. 2003-075503.

Generally in a probe card wherein a needle probe having a cantileverstructure consisting of cantilever beams, the tip of probe coming intocontact with the pad of semiconductor chips is narrow pitched, but inthe base part in contact with the probe card, due to the radiallyexpanding arrangement of the probe from the tip, a coarse pitch could beused and it was possible to fix probes to the circuit terminals of aprobe card by soldering and similar connecting means. However, thiscantilever structure had a problem of damaging the pads due to shifts inthe horizontal direction of the tip that serve as the contact point whenit comes into contact with the pad, or resulting in a fall in themeasurement yield due to the tip falling off the pad. In addition, therewere problems in that only a tip could be measured at a time and thatthe precision of fixing each probe varied resulting in a difficulty ofcontrolling the contact pressure to a constant level.

In a vertical probe replacing this cantilever structure, in other words,in a vertical probe wherein the probe is fixed vertically to the circuitterminals of probe card, it is necessary that the pad pitch on asemiconductor chip and the circuit terminal pitch on a probe card havethe same pitch interval. However, the miniaturization of circuitpatterns on a probe card which is a printed wire board is limited byfabrication technology, and therefore, it is difficult for the areaoccupied by circuit terminals and wiring width to satisfy therequirements matching the pad pitch, and also because of a limit to thepitch interval for soldering, it was impossible to vertically fix avertical probe to the probe card according to the pad pitch of thesemiconductor chip as miniaturization progressed.

Thus, in a probe card the proportion of its plane area being occupied bythe area of circuit terminals and the width of circuit interconnectionis important and obstructs the narrowing of pitch of circuit terminals.Accordingly, it was decided to adopt the means of maintaining the numberof vertical probes by using a multilayered printed wiring board for theprobe card, by arranging circuit terminals in a grid, in two lines orzigzag form and by electrically connecting the wiring between layers viathrough-holes. However, due to a large area represented by thesethrough-holes, the presence of through-holes was an obstacle fornarrowing the pitch of arranging circuit terminals. Thus, any attempt tofix vertical probes to a probe card was plagued by the difficulty ofnarrowing the pitch of circuit terminals and required an advancedtechnology in soldering and a large number of manual operations leadingto high costs of manufacturing. In order to solve these problems, theinventors of the present invention propose a vertical probe assembly andhave already proposed a probing device as an electric signal connectingdevice based on the use of such vertical probe assembly (see the PatentReference 1 and the Patent Reference 2).

FIG. 1 is a perspective view showing a vertical probe assembly as a pastexample proposed by the inventors of the present invention. As theperspective view in FIG. 1 shows, this vertical probe assembly 200already proposed (see, for example, the Patent Reference 1) consists oferecting a plurality of vertical probes 205 between two parallel upperand lower square insulating boards (or insulation films) 201 and 202.The two upper and lower insulating boards 201 and 202 are kept apart ata fixed interval being blocked by a stage in the middle of the verticalprobe 205, and the pitch arrangement of vertical probes 205 is made toagree with the pitch arrangement of pads on the semiconductor chips tobe tested. The upper and lower tips of each vertical probe 205 protrudeslightly the insulating boards 201 and 202 and serve as electric contactterminals 203, and a curved part 204 is created in the intermediate partto provide resiliency against outside force applied on the probe in thevertical direction and to absorb distortions. At the same time, thedeformation of the curved part 204 serves as the source of restoringforce of spring, and this restoring force of spring turns into contactpressure between the top of the spring force probe and the pad to giveelectric conductivity. This curved part 204 is created at differentvertical positions for each row so that the vertical probes 205 arrangedat the right angle may not come into contact each other. And eachvertical probe 205 has a square section, and is inserted into squareholes created at opposite positions of the upper and lower insulatingboards 201 and 202 so that it may move vertically but does not rotateconstituting an anti-rotating structure.

A probing device having such a vertical probe assembly (see, forexample, the Patent Reference 2) is constituted as shown in theperspective view of FIG. 2. Specifically, above this vertical probeassembly 200. a semiconductor wafer on which a large number ofsemiconductor chips to be tested not shown have been formed is set on awafer stage while the chip pads are kept upside down. On the other hand,below the vertical probe assembly 200, a connecting structure 206 isprovided to enter into contact with the vertical probe of this probeassembly 200. This connecting structure 206 is connected with a probecard 208 through a flexible flat cable 207. And the wiring on theconnecting structure 206 side of the flexible flat cable 207 is wired bythe same narrow pitch as the chip pads. And the end of wiring enablesthe wiring terminals to come into contact en bloc with the verticalprobes of the vertical probe assembly 200. And the wiring pitch intervalon the probe card 208 side of the flexible flat cable 207 is extended insuch a way that the circuit wiring terminals on the probe card 208 maybe soldered.

And the wafer stage (not shown) and the vertical probe assembly 200 canbe moved in the X-Y-Z-θ direction. And the vertical probe assembly 200,once positioned and brought into contact en bloc with the wiringterminal of a flexible flat cable provided on the connecting structure206, need not be moved until the end of the wafer test. Here, theconnecting structure 206 plays the role of a socket for connecting withvertical probes by fixing the wiring terminal surface of the flexibleflat cable 207 facing upward horizontally. As the details of thisconnecting structure have already been proposed, the description thereofis omitted here.

The wafer stage is moved in this condition, one of the semiconductorchips is positioned on the vertical probe assembly, and respectively aplurality of chip pad and the upper contact terminals of the verticalprobe assembly are connected en bloc. This enables to connectelectrically narrow pitch semiconductor chips and probe cards, anddrastic improvement of functions as probing device contributes greatlyto promote higher integration of semiconductor devices.

As described above, probing devices in which a vertical probe assemblyproposed already by the inventors of the present invention can measureeven semiconductor chips of a narrowed pad pitch of 45 μm for example.Moreover, due to the possibility of automatically assembling probeswithout resorting to soldering, it is possible to mass produce them atlow costs, and due to the possibility of vertically contacting en blocthe chip pads, it is possible to uniformly control contact pressure onall the probes. These are important advantages obtained from them.

Nevertheless, this probing device is not different from others in that aplurality of semiconductor chips formed on a semiconductor wafer aretested successively one after another, and it is necessary to move thewafer stage by one tip for each test. On the other hand, the recenttrend in the production of semiconductor wafers is for larger diameter(for example, 300 mm in diameter), and the number of semiconductor chipsformed on a semiconductor wafer ranges from several tens to severalhundreds representing an increasingly higher density. As a result, thetime required to test a piece of semiconductor wafer becomesconsiderable, and the demand is rising for a probing device providedwith multiple array of vertical probe assembly (hereinafter referred toas “multiple array vertical probe assembly”) capable of testingsimultaneously all the semiconductor chips on a wafer without moving thewafer stage. However, in the case of a wafer on which 200 chips eachhaving 100 pads are formed for example, 100×200=20,000 signal wiringcables will be required for each multiple array vertical probe assembly,and it is difficult to efficiently draw such a number of signal wiringcables from a multiple array vertical probe assembly and connect them tooutside testing apparatuses.

On the other hand, if a multiple array vertical probe assembly is to beused for a burn in test, due to a high temperature environment ofapproximately 12° C. in which it will be placed, the effect of thermalexpansion that is not an important issue for testing a chip at a time bya separate row probe assembly will grow in importance, and pitchdiscrepancy will develop between the pitch of pads formed on a siliconwafer and the pitch of vertical probes planted on insulating board madeof a resin film and the like. In particular, as the position of verticalprobes moves closer to the perimeter of the wafer, the discrepancy ofpitch of vertical probes will be cumulated, grow larger and it willbecome impossible to probe.

Lately a further higher speed and mass en bloc treatment are required.For example, a probe assembly capable of bringing simultaneouslycontacts into contact with all the pads on a waver with a diameter of 12inches (wafer of 300 mm in diameter) and of coping with high frequency.With regards to this requirement for higher speed, the following pointswill be important:

(1) Reduce electric capacity, and for this purpose reduce the area ofthe probe for the entirety.

(2) Shorten as much as possible the distance between the test circuitand the pads on a wafer.

(3) Reduce noises resulting from magnetic interference generated byprobes and wiring cables.

(4) Long distance between contacts and wiring cables opposite thereto.

With regards to wiring lines between probe assemblies and test circuits,the connection of a large number of wiring lines is required. And as aresult of narrowing of pitch, a high arraying accuracy of contacts isalso required because contacts and pads face each other over a largearea.

With regards to a growing number of wiring lines and narrowing of pitch,for example, the number of contacts in a wafer wherein 600 chips having200 pads each are formed totals as many as 120,000. It seems possible tosolve this number problem by applying a further developed method of themethod described in the Japanese Patent Disclosure 2003-075503 to theprior printed wiring board. While the pitch provided by a flat cable isnarrow 30 μm pitch, an important issue is how to cope with the wiring oftest circuits in view of such narrow pitch contacts. And supposing thata contact force of 5 g is applied on each of the 120,000 contacts, atotal force of approximately 600 kg will act on the whole probeassembly. Such a force is likely to create a problem of deformation ofmechanical parts.

The present invention is made to satisfy these requirements, and itsobject is to provide an electric signal connecting device with amultiple array structure of vertical probe assembly wherein the problemof thermal expansion and signal wiring are solved and probe assemblyused therein so that a plurality of chips may be subjected en bloc atthe same time to a probing test or a burn-in test at the time of testingthe property of semiconductor chips and other similar circuits which arenow becoming increasingly dense as a result of high integration ofelectronic devices.

SUMMARY OF THE INVENTION

The present invention includes, as electric signal connecting devices,vertical probes for establishing electric connection by entering intocontact with terminals for electric connection created in electricfunctional elements to be tested and a resin film supporting thevertical probes. The vertical probes are planted resiliently deformablyin a surface of the resin film in a direction along the surface of theresin film, an end of the vertical probes is brought into contact with aterminal of the electric functional elements to be tested and anotherend of the vertical probe is brought into contact with the terminal ofan electric function testing device so that signals may be transmittedand received between the electric functional elements to be tested andthe electric function testing device.

The present invention includes also, as electric signal connectingdevices, a plurality of vertical probes to be brought into contact witha plurality of terminals for electric connection created in the electricfunctional elements to be tested, and includes, in the electric functiontesting device for establishing electric connection, respectively aplurality of sets of units in an X direction and of units in a Ydirection crossing with the units in the X direction formed by aplurality of ribbon-like resin films having a plurality of verticalprobes laid out together, and the plurality of sets of units in the Xdirection and units in the Y direction are arranged in a grid form on asupporting board to be positioned and fixed there, and the verticalprobes positioned at each crossing of the units in the X direction andthe units in the Y direction are brought into contact en bloc with allthe terminals of the electric functional elements to be tested so thatsignals may be transmitted and received between the electric functionalelements to be tested and the electric function testing device.

The present invention also includes, as a probing device, respectively aplurality of sets of units in the X direction and of units extending inthe Y direction consisting of a plurality of ribbon-like resin filmshaving a plurality of vertical probes laid out together in the probingdevice, wherein vertical probes are brought into contact with thesemiconductor chips to be tested formed in a semiconductor wafer toestablish electric contact with the testing device through thesevertical probes, and the plurality of sets of units in the X directionand units in the Y direction are arranged in a grid form on a supportingboard to be positioned and fixed there, and the vertical probespositioned at each crossing of the units in the X direction and theunits in the Y direction are brought into contact en bloc with all thepads of semiconductor chips formed in a semiconductor wafer to be testedto carry out probing tests.

In the present invention, all the crossing positions of a plurality ofsets of units in the X direction and of units in the Y direction inwhich the vertical probes are arranged correspond one to one to all thesemiconductor chips formed on a semiconductor wafer to be tested, andthe array of the vertical probes arranged in each crossing position ofthe units in the X direction and the units in the Y direction agreeswith the array of pads in each semiconductor chip to be tested. Inaddition, the means of fixing and positioning the units in the Xdirection and the units in the Y direction exist in a large numberdepending on the specifications required of the units in the X directionand the units in the Y direction and can be dealt with selectively.However, in the embodiment of the present invention, a plurality ofprops planted in matrix array on the supporting board are placed asmeans of positioning the units in the X direction and the units in the Ydirection in the X, Y and Z directions.

In the present invention, a pair of vertical probe assembly wherein aplurality of resiliently deformable probing parts, a plurality ofelectric conducting means and a plurality of wiring parts havingresilient terminals are electrically and physically connected on afilm-shaped resin surface which is a non-electric conductive materialhaving a plurality of punched holes and notched holes, and are disposedat desired positions while maintaining the functions of the film-shapedresin, the probing part and the wiring part and promoting the dynamicfunction and mechanical functions of the probing part by their synergicaction constitute a unit of production. The ribbon-shaped resin filmconsists of a ribbon-shaped film in the X direction and a ribbon-shapedfilm in the Y direction, and a vertical probe having a curved partplanted on a copper foil laminated resin film and a wiring patternlinked therewith are formed by etching, and the ribbon-shaped resin filmis arranged in such a way that the direction of the curved part of theadjacent vertical probes may be inverse. Unlike in the past when probesand wiring have been processed separately, the present invention adoptedintegral processing in order to realize an integral structure and toreduce the number of processing and assembly operations. And because ofthe integral structure, probes and wiring are differentiated in thepresent invention by a definition that the part subsequent to the pointwhere the pattern is supported by the square bars 8 a and 8 b andcontact pressure is not applied to the pattern is wiring.

In the present invention, the ribbon-shaped film in the X direction islaid out in such a way that an end of the vertical probe protrudes fromthe upper end in the longitudinal direction, and the other end trailsdown passing through the curved part and extends to the end of theribbon-shaped film along the lower end to form a wiring means. On theother hand, the resin film part has the first opening cut out in such away that it is surrounded by the curved part, and the second opening cutout at a same interval along the longitudinal direction for allowing aribbon-shaped film in the Y direction pass through at the right angle.The ribbon-shaped film in the Y direction is laid out in such a way thatan end of the vertical probe protrudes from the upper side in thelongitudinal direction, and the other end trails down passing throughthe curved part and extends to the end of the ribbon-shaped film alongthe lower side to form a wiring means, and is formed in such a way thatthe length of protrusion of the vertical probe is longer than the lengthof protrusion of the ribbon-shaped film in the X direction. On the otherhand, the resin film part has an opening cut out in such a way that itis surrounded by the curved part. The structure of passing theribbon-shaped film in the Y direction through the second opening at theright angle is arranged in the lower stage in the arranging method ofsimply superposing the unit 105 in the X direction and the unit 106 inthe Y direction. For example, the top of the unit in the X direction iselongated, and it will be difficult to obtain a good vertical probeform, The opening 1 is in a form composed by a slit through which acoupling member subjected to contact pressure passes through and a slitfrom which vicinity of the curved part is cut off so that the force bythe contact pressure of the vertical probe may act as direct contactforce on the curved part without being subjected to complicated vectorforce from the resin film. The opening in the resin film is not limitedto opening 1 and opening 2, and its number, form and array position maybe chosen as required in order to obtain good characteristics of thepresent invention and also to enable simple production.

In the present invention, the ribbon-shaped films in the X and Ydirections are designed to absorb displacement in the axis direction ofthe vertical probe at the time of test by the resilient deformation ofthe narrow resin film width part formed by the opening opened in such away that it is surrounded by the curved part and the upper part of theresin film, and when the units in the X direction and the units in the Ydirection are arranged in the grid form, the height of the top of thevertical probes respectively protruding from the ribbon-shaped films inthe X and Y directions agree. In addition, when the units in the Xdirection and the units in the Y direction are arranged in the gridform, the units in the Y direction are arranged to penetrate through theunits in the X direction.

In the present invention, the wiring cable formed in the ribbon-shapedfilms in the X and Y directions is folded upward at the end of theribbon-shaped films, and the top protrudes from the upper side of theribbon-shaped films to be connecting pins for outside connection, and aplurality of ribbon-shaped films in the X and Y directions constitutingrespectively the units in the X and Y directions are wired in such a waythat the protrusion position of the connecting pins will be successivelyshifted when they are placed side by side to form a unit. A plurality ofconnecting pins having the same function of the units in the X directionand the Y direction are concentrated into one for connecting with theoutside testing device.

In the present invention, the electric wiring connector is aribbon-shaped film on both sides of which copper wiring patterns areformed, and this ribbon-shaped film is covered with an insulating filmon both sides including the copper wiring patterns. The copper wiringpatterns formed on both sides of this ribbon-shaped film are, on thesurface side, a plurality of common copper wiring patterns formed inparallel along the longitudinal direction, and are, on the back side, aplurality of copper wiring patterns formed in a direction orthogonal tothese common copper wiring patterns. In addition, the copper wiringpatterns formed on both sides of the ribbon-shaped film are electricallyconnected between freely chosen wiring lines at their orthogonalcrossing positions through through-holes, and the top of copper wiringpatterns crossing at right angle in the longitudinal direction protrudeslightly upward from the ribbon-shaped film side to constituteconnecting terminals with vertical probes in the individual array probeassembly. And the top of the copper wiring patterns crossing at rightangle in the longitudinal direction protrude slightly from both theupper side and the lower side of the ribbon-shaped film to formconnecting terminals for coming into contact with vertical probes in theindividual probe assembly at both upper and lower sides.

In the present invention, when the ribbon-shaped films are inserted, thesurface on the copper wiring pattern side having connecting terminals isarrayed to face the lateral surface of the pedestal, and the copperwiring patterns having connecting terminals formed in this ribbon-shapedfilm are structured in such a way that a plurality of them constitute agroup and a plurality of groups branch from the common copper wiringpattern at an equal pitch. Wiring terminals of the common copper wiringpattern are provided at an end in the longitudinal direction of theribbon-shaped film so that they may be inserted into the sockets forconnecting with outside testing devices. In addition, each group ofcopper wiring patterns having connecting terminals formed on theribbon-shaped film is respectively arrayed facing each semiconductorchip multiple arrayed in a semiconductor wafer. And two sheets of theribbon-shaped films are superposed and the position of connectingterminals therein is slid so that they may be in zigzag and form twolines so that it may be possible to adapt to the zigzag arrangement ofchip pads.

The probing device of the present invention is for conducting probingtests of the pads of a plurality of semiconductor chips formed on asemiconductor wafer by bringing respectively vertical probes en bloc atthe same time into contact on the same pads and then successively forconducting burn-in tests. At the time of a burn-in test, the thermalexpansion of the ribbon-shaped films is contained by means of agrid-shaped positioning bar positioned by a prop, the vertical probes ofindividual probe assembly and the connecting terminals of ribbon-shapedfilms are prevented from sliding in their respective position and thusthe expansion of the entire multiple array probe assembly is contained.By the adoption of such a control mechanism, it becomes possible tomeasure semiconductor chips formed in the periphery of a semiconductorwafer at the time of a burn-in test.

According to the present invention, for testing the property ofsemiconductor chips that become increasingly densely packed withinformation keeping pace with further rise in the degree of integrationof electronic devices, it has become possible to conduct probing testsand burn-in tests en bloc at the same time on a plurality ofsemiconductor chips formed on a semiconductor wafer. Specifically, aplurality of sets of units in the X direction and units in the Ydirection wherein a plurality of ribbon-shaped resin films each having aplurality of vertical probes are laid out are provided, and thisplurality of units in the X direction and units in the Y direction arearrayed in the grid shape on the supporting board to be positioned andfixed there. In this way, the vertical probe assembly is constitutedwith a multiple-array structure.

As a result, it has become possible to contain the sliding of the wholemultiple array structure due to thermal expansion, and it has becomeeasily possible to conduct probing tests by bringing the vertical probesarranged at each crossing position of the units in the X direction andthe units in the Y direction into contact en bloc with all the pads ofthe semiconductor chips to be tested formed on a semiconductor waferwithout any displacement in position. It is also possible to use theprobing device of the present invention in a burn-in test whereinelectric stresses are applied to circuits in a high temperature toconduct acceleration tests of semiconductor chips. The use ofribbon-shaped resin films simplifies the drawing of wiring and theconnecting terminal structure to outside devices, and consequently itbecomes possible to provide probing devices solving the thermalexpansion problem and the signal wiring problem.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a prior vertical probe assembly;

FIG. 2 is a perspective view of a prior probing device;

FIG. 3 is a block diagram showing the system structure of a priorelectric function testing device;

FIG. 4 is a block diagram showing the system structure adapted tomultiple wiring and to high speed as a system of the electric functiontesting device related to the present invention;

FIG. 5 is a perspective view showing the structure of a multiple arrayvertical probe assembly related to Embodiment 1 of the presentinvention;

FIG. 6 is a partial perspective view showing the internal structureaccording to Embodiment 1 ditto;

FIG. 7 is a perspective view showing the ribbon-shaped film in the Xdirection according to Embodiment 2 ditto;

FIG. 8 is an enlarged front view of the section A of FIG. 7;

FIG. 9 is a front view showing the ribbon-shaped film in the Y directionaccording to Embodiment 2 ditto;

FIG. 10 is a perspective view showing the unit in the Y direction beingassembled according to Embodiment 2 ditto;

FIG. 11 is a perspective view of the square bar according to Embodiment2 ditto;

FIG. 12 is a partial perspective view showing the structure of amounting stand according to Embodiment 2 ditto;

FIG. 13 is a partial perspective view showing the structure of amounting stand according to Embodiment 2 ditto;

FIG. 14 is a perspective view of a prop according to Embodiment 2 ditto;

FIG. 15 is a perspective view showing the wiring structure of theribbon-shaped films in the X and Y directions according to Embodiment 1and 2 ditto;

FIG. 16 is a front view showing the structure of a ribbon-shaped filmaccording to Embodiment 3 of the present invention;

FIG. 17 is a perspective view of a test piece according to Embodiment 4of the present invention;

FIG. 18 is a side view of a probe according to Embodiment 4 ditto;

FIG. 19 is a perspective view of a test piece according to Embodiment 5of the present invention;

FIG. 20 is a side view of a probe according to Embodiment 5 ditto;

FIG. 21 is a front view of a probe according to Embodiment 6 of thepresent invention;

FIG. 22 is a schematic illustration of the probe part shown in FIG. 21as seen from the side and shows the path of transmitting contact forceand the path of electric signals;

FIG. 23 is a front view of the ground line pattern according toEmbodiment 6 ditto;

FIG. 24 is a front view of a film according to Embodiment 6 ditto;

FIG. 25 is a front view of an insulating film according to Embodiment 6ditto;

FIG. 26 is a front view of the current conductive part of a probeaccording to Embodiment 7 of the present invention;

FIG. 27 is a side view of the current conductive part of a probeaccording to Embodiment 7 ditto;

FIG. 28 is a front view of a probe according to Embodiment 8 of thepresent invention;

FIG. 29 is a front view of the ground line pattern according toEmbodiment 8 ditto;

FIG. 30 is a front view showing the output transforming part of theground line pattern according to Embodiment 8 ditto;

FIG. 31 is a perspective view showing the probe part of a probe assemblyaccording to Embodiment 9 of the present invention;

FIG. 32 is schematic illustration of the probe part shown in FIG. 31 asseen from the side and shows the path of transmitting contact force andthe conductive path of electric signals;

FIG. 33 is a front view of a probe according to Embodiment 9 of thepresent invention;

FIG. 34 is a front view of the ground line pattern thereof;

FIG. 35 is a front view of a film according to Embodiment 9 of thepresent invention;

FIG. 36 is a descriptive illustration of avoiding interference of probesaccording to Embodiment 10 of the present invention;

FIG. 37 is a perspective view of the electric wiring connector in themultiple array probe assembly according to the present invention;

FIGS. 38A and 38B are a side view and a front view of the ribbon-shapedfilm in the X direction in the multiple array probe assembly accordingto the present invention;

FIGS. 39A and 39B are a side view and a front view of the ribbon-shapedfilm in the Y direction according to Embodiment 10 ditto;

FIG. 40 is a top plan view showing a positioning bar in the X-Ydirection being assembled according to Embodiment 10 ditto;

FIG. 41 is a perspective view showing the structure of the positioningbar in the X-Y direction according to Embodiment 10 ditto;

FIG. 42 is a perspective view of the crossing of the positioning bar inthe X-Y direction according to Embodiment 10 ditto;

FIG. 43 is a top plan view showing the positioning bar in the X-Ydirection and the ribbon-shaped film in the X-Y direction beingassembled according to Embodiment 10 ditto;

FIGS. 44A to 44D are a process illustration showing the process ofassembling the positioning bar in the X-Y direction and theribbon-shaped film in the X-Y direction according to Embodiment 10ditto;

FIG. 45 is a perspective view showing the structure of socket of theribbon-shaped film according to Embodiment 10 ditto;

FIG. 46 is an illustration describing the electric wiring connection toa semiconductor wafer according to Embodiment 10 ditto;

FIG. 47 is a perspective view showing an example of application of theribbon-shaped film according to Embodiment 10 ditto;

FIG. 48 is a front view showing an example of application of the sameribbon-shaped film as the one shown in FIG. 47 in the case where chipsare arranged in two lines at equal intervals;

FIG. 49 is a sectional view showing an example of application of thesame ribbon-shaped film as the one shown in FIG. 47;

FIG. 50 is a perspective view of Embodiment 11 of the present invention;

FIG. 51 is a further enlarged perspective view of the main part of FIG.50;

FIG. 52 is an illustration showing the connection of connecting wiringcables from two electronic devices with the pads on chips according toEmbodiment 11 ditto;

FIG. 53 is a view seen from the arrow X direction in FIG. 50;

FIG. 54 is a view seen from the arrow Y direction in FIG. 50;

FIG. 55 is a perspective view of Embodiment 12 of the present invention;

FIG. 56 is a front view of the two axis testing circuit according toEmbodiment 12 ditto;

FIG. 57 is a view seen from the arrow X direction in FIG. 50; and

FIG. 58 is a view seen from the arrow Y direction in FIG. 50.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Before proceeding to the description of the embodiments of the presentinvention, an explanation will be given on the current system by whichwafer tests representing one of electric function tests in relation toprobe cards are being carried out.

FIG. 3 is a block diagram showing the current system structure ofelectric function testing devices (in other words an example of theprior arts) in the field of the present invention. In FIG. 3, the code70 represents a dedicated tester. Generally the dedicated tester 70 usedin the current system is large-sized and expensive. The dedicated tester70 generates electric signals required in the tests of chip 72 andinputs the same into the chip 72 through a probe card 71. The dedicatedtester tests will be conducted based on the signals from the chip 72corresponding to the inputted signals. The number of signal lines fromthe dedicated tester 70 up to the probe card 71 is approximately 1,100even when the number of wiring lines for inputting into the chip 72 isapproximately 200, and these approximately 1,100 wiring lines enable tocope with a plurality of pad tests. However, when the number chips 72has increased very much, for example in the case of coping with 300chips, the number of wiring lines required will be 60,000 and it will bedifficult to send signals by distributing to a large number of chipsfrom approximately 1,100 wiring lines of the dedicated tester. And evenif wiring is possible, responses with a large number of wiring lines forhigh-speed tests will not be effective. Therefore, the current systemshown in FIG. 3 can cope with the case of the probes responding at thesame time to a limited number of chips.

FIG. 4 is a block diagram showing a system structure for coping with alarge number of wiring lines and for coping with high speed requirementas a system of electric function testing device according to the presentinvention. In FIG. 4, the code 73 represents a general-purpose computer,for example a PC. The code 74 represents a probe card having a circuit.It is shown by a broken line. The probe card 74 having a circuitconsists of an interface 75 and testing circuits 76. The testingcircuits 76 are plural and each of them is started for tests ofdifferent purposes. This plurality of testing circuits 76 are notlimited to the same functions. The code 72 represent a chip. Thegeneral-purpose computer sends testing information for each individualwafer to the interface 75. The interface 75 sends test contents to thetesting circuits 76. The testing circuits 76 have testing informationcorresponding to chips, and send required information to the chips atthe time of test. And it also receives and evaluates test resultinformation from the chips 72, and sends the information to thegeneral-purpose computer 73 through the interface 75. And the testingcircuits 76 are related one-to-one with chips, and the number of pads ineach chip 72 and approximately the same number of testing circuits 76enable wiring lines to connect with the pads in each chip 72.

Embodiment 1

The following is a detailed description of Embodiment 1 of the probingdevice of the present invention with reference to drawings. The presentembodiment 1 is an effective system when it is applied to the currentsystem shown in FIG. 3, and the integration of wiring lines with probeseliminates the necessity of expensive multilayered board and the like ofthe prior probe card.

FIG. 5 is a perspective view showing Embodiment 1 of a multiple arrayvertical probe assembly according to the present invention. The basicstructure of the multiple array vertical probe assembly according to thepresent Embodiment 1 is made up by combining in the grid form a unit inthe X direction 5 formed by arranging in the vertical direction aplurality of ribbon-shaped films in the X direction 1 on which aplurality of vertical probes 3 patterned by etching in the longitudinaldirection, and, like this unit in the X direction 5, a unit in the Ydirection 6 formed by arranging in the vertical direction a plurality ofribbon-shaped films in the Y direction 2 on which a plurality ofvertical probes 4 patterned by etching in the longitudinal direction areformed.

Both the ribbon-shaped film in the X direction 1 and the ribbon-shapedfilm in the Y direction 2 are formed by a ribbon-shaped or belt-shapedinsulating film wherein copper and other conductive foils are laminated.And in the present Embodiment 1, the ribbon-shaped film in the Xdirection 1 and the ribbon-shaped film in the Y direction 2 havebasically the same structure.

The vertical probe 3 of the ribbon-shaped film in the X direction 1includes a curved part 31 formed to the letter U in the longitudinaldirection within the surface of the ribbon-shaped film in the Xdirection 1, upper supporting legs 32 and lower supporting legs 33extending outward approximately at the right angle at the end of openingof the curved part 31, and a contact point 34 provided at the top ofeach supporting leg 32.

And the vertical probe 4 of the ribbon-shaped film in the Y direction 2includes a curved part 35 formed to the letter U in the longitudinaldirection within the surface of the ribbon-shaped film in the Ydirection 2, upper supporting legs 36 and lower supporting legs 37extending outward approximately at the right angle at the end of openingof the curved part 35, and a contact point 38 provided at the top ofeach supporting leg 36.

And the unit in the X direction 5 and the unit in the Y direction 6 arearranged in a vertical positional relationship with the unit in the Xdirection 5 being arranged above and the unit in the Y direction 6 beingplaced below and when seen from above they are arranged to be crossingeach other. In such an arrangement, in order to make the height of thecontact point 34 of the unit in the X direction 5 to agree with thecontact point 38 of the unit in the Y direction 6, the length of theupper supporting legs 36 of the vertical probes 3 is set longer than thelength of the upper supporting legs 32 of the vertical probes 4. Thedifference of length of the upper supporting legs 36 and the uppersupporting legs 32 is equal to the difference in level between the unitin the X direction 5 and the unit in the Y direction 6.

In this basic structure, the area of crossing 100 between the unit inthe X direction 5 and the unit in the Y direction 6 (the rectangulararea enclosed by chain lines with one dot in FIG. 5) represents an areaoccupied by a semiconductor chip. Taking the area 100 as the center forobservation, as a plurality of semiconductor chips can be arranged insuccession in the X direction and the Y direction, a plurality of theareas themselves can be arranged in succession in the X direction andthe Y direction when the area 100 is taken as the center of observation.The arrangement of contact points 34 and 38 of the vertical probes 3 and4 in the area 100 corresponds to the chip pads which are terminals on asemiconductor chip. Hereafter, this structure will be the basis of thedescription of the embodiments of the probing device of the presentinvention. Incidentally, the copper foil constituting the ribbon-shapedfilms 1 and 2 is made up of gold foil, silver foil, or beryllium copperand other highly conductive materials, and the ribbon-shaped films 1 and2 are made of synthetic resins such as polyimide resin, polyvinylchloride resin and the like.

In the present Embodiment 1, the wiring lines (or signal lines) 39 and40 for taking out signals inputted from the contact points 34 and 38extend from the lower supporting part 33 and 37 of the vertical probes 3and 4. These wiring lines are also formed by etching like the verticalprobes 3 and 4. The wiring lines 39 and 40 extend once downward on thesurface of the ribbon-shaped films 1 and 2 from the lower supportingparts 33 and 37 of the vertical probes 3 and 4, are bent approximatelyat the right angle near the lower end of each ribbon-shaped film 1 and 2(to face in the longitudinal direction of each ribbon-shaped film 1 and2), extend along each ribbon-shaped film 1 and 2 and head towards theoutput terminals. The adoption of such a structure enables to gather theoutput wiring lines of a plurality of vertical probes 3 and 4 near thelower end of each ribbon-shaped film 1 and 2 and to extend them to theoutput terminals. Thus, it is possible to simplify the structure of themultiple array vertical probe assembly.

The following is a description of the structure of the ribbon-shapedfilm in the X direction 1 and the ribbon-shaped film in the Y direction2 with reference to the front view of FIG. 9. FIG. 9 is essentially usedfor the description of the ribbon-shaped film in the Y direction 2 inEmbodiment 2 of the present invention (described later on). However,this is, in Embodiment 1 of the present invention, almost the same asthe structure of the ribbon-shaped film in the X direction 1 and theribbon-shaped film in the Y direction 2 except for some differences, andis used for similar descriptions.

In the ribbon-shaped film in the X direction 1, an opening 10 is createdin the part where a pair of vertical probes 3 are facing against eachother. The opening 10 is, as shown in FIG. 9, a nearly T-shaped openingcreated in the boundary part between adjacent units a (for example a-1and a-2), and it is created by punching the inner side of curved parts31 facing each other of the vertical probes 3. As a result, the forceapplied in the arrow S1 direction to the contact points 34 of thevertical probes 3 acts on the whole curved parts 31 of the verticalprobes 3 without being subjected to forces in complicated directionsfrom the resin film by the cutting out of this opening 10 andresiliently deforms the vertical probes 3. In other words, when viewedfrom the other side, as the basic form of the entire ribbon-shaped filmin the X direction 1 is belt-shaped, it deforms freely in response tooutside forces applied in the vertical direction to its surface, but itdoes not deform against outside forces applied in the direction alongits surface (either in the longitudinal direction or in the widthdirection).

However, in the present Embodiment 1, vertical probes 3 are planted onthe surface of the ribbon-shaped film in the X direction 1, and theinner side of the curved parts 31 of these vertical probes 3 is punchedthrough to create openings 10. Therefore, in the curved parts 31 of thevertical probes 3, the ribbon-shaped film in the X direction 1 candeform in the surface direction (in the width direction of the surface).Incidentally, the ribbon-shaped film in the X direction 1 is designedbasically not to deform in the surface direction in any parts other thanthe curved parts 31 of the vertical probes 3. Furthermore, on the upperside of the opening 10 the film material of the ribbon-shaped film inthe X direction 1 expands continuously. And the same thing can be saidon the structure of the ribbon-shaped film in the Y direction 2. Thestructure described above is the structure of the probe assembly and isthe basis of the signal detection operation of the probing devices.

Embodiment 2

FIG. 6 is a partial perspective view describing the structure of theprobing device according to Embodiment 2 of the present invention.Embodiment 2 of the present invention is characterized in that theacting point of contact pressure and the supporting parts subjected tothis contact pressure are in the ending position of the curved partsregardless of the number of arrays of multiple arrays and the number ofwiring lines, and a good spring characteristic of probes can beobtained. It is also characterized in that the wiring part is behind thesupporting part and is unlikely to be affected by the resiliencyproperty of probes, a sufficient space available for electric wiring canbe secured, and wiring pattern forms sufficiently taking into accountelectric property can be obtained. And the probing device using themultiple array vertical probe assembly of the present Embodiment 2 isnot constituted by arranging individual probe assemblies in the matrixpattern as in the past, but as FIG. 6 shows a plurality of verticalprobes 3 having a curved part are patterned by etching on aribbon-shaped insulating film made by laminating copper foils, and thispatterned ribbon-shaped film is chosen as the ribbon-shaped film in theX direction 1. Similarly, a plurality of vertical probes 4 are patternedon the ribbon-shaped film, and this patterned ribbon-shaped film ischosen as the ribbon-shaped film in the Y direction 2. Incidentally, theribbon-shaped films in the X and Y directions 1 and 2 have a pluralityof probes and wiring lines on one surface, and the positionalrelationship that should be arranged on the surface is secured by theirrespective pattern formation. And the curved parts of adjacent verticalprobes facing each other are arranged in the inverse direction so thatthe arrangement of the contact points of the vertical probes 3 and 4 maycorrespond with the chip pads on a chip. This arrangement in the inversedirection results in each vertical probe 3 and 4 corresponding to a chipin the wafer being positioned in the area projected for the chip.

A plurality of ribbon-shaped films in the X direction 1 are arrangedtogether to constitute a unit in the X direction 5, a plurality ofribbon-shaped films in the Y direction 2 are arranged together toconstitute a unit in the Y direction 6, and this unit in the X direction5 and the unit in the Y direction 6 are combined in the grid shape toconstitute a multiple array vertical probe assembly. Furthermore, thisassembly is fixed on a plurality of props 8 planted on the supportingboard (not shown) to constitute a probing device.

And unlike the prior art wherein an individual probe assemblycorresponded with a chip on the wafer, in the present invention thearrangement of vertical probes 3 and 4 at each crossing position whenthe units in the X direction and the units in the Y direction arecombined corresponds to the pad pitch of a chip. And when the units inthe X and Y directions 5 and 6 are combined, the thickness of resinfilms is reconciled in advance, or is adjusted through spacers, or theyare precisely positioned by means of indented indices 8 c and 8 d on theperimeter of square bars 8 a and 8 b so that the pitch of the verticalprobes 3 and 4 may coincide with the pad pitch of semiconductor chips.The method of arranging closely a plurality of indices 8 c and 8 d ofthe present invention for positioning will be described separately.

The following is the description in concrete terms on each component ofthe multiple array vertical probe assembly described above. FIG. 7 is aperspective view of the ribbon-shaped film in the X direction 1 whereinvertical probes 3 are patterned. FIG. 8 is a partially enlarged frontview of the ribbon-shaped film in the X direction 1. To begin with,prepare a belt-shaped film made of a polyimide resin or othernonconductive film laminated with beryllium copper foil and otherconductive materials and form a ribbon-shaped film in the X direction 1wherein vertical probes 3 are patterned by etching. The vertical probe 3has a curved part 31 formed to the U letter in the longitudinaldirection on the surface of the ribbon-shaped film in the X direction 1,upper supporting legs 32 and lower supporting legs 33 extending outwardnearly at the right angle at the end of the opening of the curved part31, and the contact points 34 provided at the top of the uppersupporting legs 32. In the ribbon-shaped film in the X direction 1, twovertical probes 3 with the back of their curved part 31 arranged to faceeach other are taken as one unit a, and a plurality of units a arepatterned in the longitudinal direction of the ribbon-shaped film in theX direction 1 in the order of a-1, a-2, a-3 . . . . The number of unitsa is determined according to the number of chips to be formed on awafer. At this time, the longitudinal section of the resin film shouldbe removed so that the top part (part where the contact points 34 areformed) of the upper supporting legs 32 of vertical probes 3 protrudesby a length L1 from the edge of the upper long side of the ribbon-shapedfilm in the X direction 1. The contact point 34 of the vertical probe 3serves as a probe for contacting the chip pad of the semiconductor chipat the time of probing test, and therefore the top should be as sharp asan edge.

And, the ribbon-shaped film in the X direction 1 has a plurality offirst openings 9. The first openings 9 are rectangular punched holescreated at the lower part of the vertical probe 3 corresponding to eachunit a, and serve to allow the passage of the units in the Y direction 6as shown in FIG. 6. The opening 10 is, as shown in FIG. 8 (enlargedfront view of the section A of FIG. 7), a nearly T-shaped openingcreated in the boundary part between the adjacent units a (for examplea-1 and a-2), and is created by cutting out the inner part of the curvedparts 31 facing each other of the vertical probes 3. As a result, theforce applied in the arrow S1 direction to the contact point 34 of thevertical probe 3 acts on the whole curved parts 31 of the verticalprobes 3 by the creation of this opening 10 without being subjected toforces in complicated directions from the resin film, and resilientlydeform the vertical probes 3. In other words, when viewed from anotherangle, the ribbon-shaped film in the X direction 1 whose basic form inits entirety is belt-shaped freely deforms in response to outside forcesapplied at the right angle to its surface, but does not deform againstoutside forces applied in the direction along its surface (whether inthe longitudinal direction or in the width direction of the belt).However, in the present invention, due to the plantation of verticalprobes 3 on the surface of the ribbon-shaped film in the X direction 1and the creation of an opening 10 by cutting through the inner part ofthe curved parts 31 of these vertical probes 3, the ribbon-shaped filmin the X direction 1 can deform in the surface direction (in the widthdirection of the surface) in the section of the curved parts 31 of thevertical probes 3. Incidentally, the ribbon-shaped film in the Xdirection does not deform in the surface direction in sections otherthan the curved part 31 of the vertical probe 3. The vertical probe 3deforms (shown by broken line) by the contact pressure (arrow S . . . 1)applied to the contact point 34 part at the time of test, and thisdeformation generates restoring force, which acts as contact force thatenables electric conduction with the contact point 34 between the chippads on the wafer and the vertical probes 3. And the ribbon-shaped filmin the X direction 1 itself functions as a means of maintainingprecisely the positional relationship of a plurality of vertical probes3 arranged in a straight line in the longitudinal direction on itssurface rather than contributing to the promotion of dynamic propertysuch as generating the contact pressure of the vertical probes 3. Italso plays an important role as a means of positioning in the surfacedirection of the film of the vertical probes 3 when a plurality ofribbon-shaped films in the X direction 1 are arranged to constitute aunit in the X direction 5. It also functions as an insulating meansbetween adjacent probes or between adjacent wiring lines.

And in the ribbon-shaped film in the X direction 1, as shown in FIG. 8,wiring patterns 39 are formed at the same time as the vertical probes 3are formed. These wiring patterns 39, totaling two lines respectivelyfrom each unit a, specifically one line from two vertical probes 3included in one unit, extend downward from the vertical probes 3 passingthrough the range of height of the opening 9, bend downward at the rightangle at the lower end of the ribbon-shaped film in the X direction 1and head in the horizontal direction, forms wiring lines in the areabetween the lower long side and the opening 9 and extend in thelongitudinal direction of the ribbon-shaped film in the X direction 1.The square hole 10 a near the center of the opening 10 is a hole forallowing the passage of square bars for positioning when theribbon-shaped films in the X direction 1 are laid out together asdescribed later on.

The following is a description of the ribbon-shaped film in the Ydirection 2 with reference to the front view in FIG. 9. Theribbon-shaped film in the Y direction 2 has a different structure fromthe ribbon-shaped film in the X direction 1 described above. This isbecause the ribbon-shaped film in the X direction 1 and theribbon-shaped film in the Y direction 2 are assembled crosscutting eachother in the grid form in such a way that the height of the contactpoints provided at the top of the vertical probes 3 and 4 may bereconciled. In the first place, the width of the ribbon-shaped film 2 isnarrower than that of the ribbon-shaped film 1 because there is no needfor a rectangular opening. And the curved part 35 of the vertical probe4 of the ribbon-shaped film in the Y direction 2 is formed at a positionlowered by a fixed distance so that, after the assembly, the curved part35 of the vertical probes 4 of the ribbon-shaped film in the Y direction2 may not interfere with the curved part 31 of the vertical probes 3 ofthe ribbon-shaped film in the X direction 1. For this reason, the longerside part of the ribbon-shaped film 2 is removed so that the contactpoint 38 may protrude by a length L2 (>L1) from the upper longer side ofthe ribbon-shaped film in the Y direction 2.

Like the ribbon-shaped film in the X direction 1, as soon as thevertical probe 4 is formed, two wiring patterns 43 respectively fromeach unit a are formed along the lower longer side of the ribbon-shapedfilm 2, And the ribbon-shaped film in the Y direction 2 is formed byforming a plurality of this unit a. The cross-shaped opening 10 formedbetween adjacent units a is formed in the same form as the ribbon-shapedfilm 1 so that it may have the effect of absorbing the distortions ofthe vertical probe 4. In any case, width h including the top 42 of thevertical probe 4 of the ribbon-shaped film 2 must be smaller than thedimension of the hole H of the opening 9 of the ribbon-shaped film 1. Asquare hole 10 a is cut out near the center of the opening 10 in thesame way as the ribbon-shaped film in the X direction 1.

The following is a description of the structure of a multiple arrayvertical probe assembly formed by assembling units in the X and Ydirections 5 and 6 on the supporting board. FIG. 10 is an explodedperspective view describing a unit in the Y direction 6 being assembledby putting together a plurality of ribbon-shaped films in the Ydirection 2. This process consists of inserting a square bar 8 b havinga U-shaped section shown in FIG. 11 into a square hole 10 a of theopening 10 at the right angle to the surface of the ribbon-shaped filmsin the Y direction 2 and of holding them together in order to preventthe ribbon-shaped films in the Y direction 2 from being dissociated whena plurality of ribbon-shaped films in the Y direction 2 are put together(in other words, put them in order). Each vertical probe 4 hasprotrusions 44 formed in advance and these protrusions 44 and the squarebar 8 b are joined together by rendering these protrusions 44 slidablewith the square bar 8 b and by making the top of the protrusions bumpagainst the side surface of the square bar 8 b and each ribbon-shapedfilm in the Y direction 2 is positioned in the longitudinal direction.Each square bar 8 b has a plurality of protrusions 47 at predeterminedintervals on its side surface. These protrusions 47 serve to determinethe interval of arrangement of a plurality of ribbon-shaped films in theY direction 2 composing a unit in the Y direction 6. And the arrangementof a plurality of (or it may be one) ribbon-shaped film or films in theY direction at equal intervals between a protrusion 47 and the followingprotrusion 47 enables to determine the pitch of contact points 38 in theX direction. A shelf part 49 extending in the longitudinal direction ofthe square bar 8 b by protruding outward from the protruding surface ofthe protrusion 47 is provided at a position below the protrusion 47 onthe side surface of the square bar 8 b. This shelf part 49 plays therole of hooking a protrusion 44 formed on the vertical probe 4 of theribbon-shaped film in the Y direction 2 and supporting the verticalprobe 4 from below when the square bar 8 b is inserted into the opening10 a of the ribbon-shaped film in the Y direction 2.

Likewise, for the unit in the X direction 5, in order to preventribbon-shaped films 1 from dissociating themselves (in other words, toput them in order) as shown in FIG. 6, a square bar 8 a with a U-shapedsection shown in FIG. 11 is inserted into a square hole 10 a of theopening 10 at the right angle of the ribbon-shaped films 1 to hold themtogether. And as shown in FIG. 8, each vertical probe 3 has a protrusion42 formed in advance, and these protrusions and the square bar 8 a arejoined together by rendering these protrusions 42 slidable with thesquare bar 8 a and by bringing the top of the protrusions into contactwith the side surface of the square bar 8 a by bumping against thelatter and thus each ribbon-shaped film in the X direction 1 ispositioned in the longitudinal direction. In this way, units in the Xand Y directions 5 and 6 are respectively formed as slender blocks.Incidentally, props 8 a and 8 b are made of non-conductive materials ormaterials coated with an insulating material. Each square bar 8 a has aplurality of protrusions 46 at predetermined intervals on its sidesurface. These protrusions 46 serve to determine the arrangementinterval between a plurality of ribbon-shaped films in the X direction 1constituting a unit in the X direction 5. And the arrangement of aplurality of (may be one) ribbon-shaped film or films in the X direction1 at equal intervals between a protrusion 46 and the followingprotrusion 46 enables to determine the pitch of contact points 34 in theY direction. A shelf part 48 extending in the longitudinal direction ofthe square bar 8 a by protruding outward further than the protrudingsurface of the protrusion 46 is provided at a position below theprotrusion 46 on the side surface of the square bar 8 a. This shelf part48 plays the role of hooking a protrusion 42 formed on the verticalprobe 3 of the ribbon-shaped film in the X direction 1 and supportingthe vertical probe 3 from below when the square bar 8 a is inserted intothe opening 10 a of the ribbon-shaped film in the X direction 1.

The following is a description of the structure of a multiple arrayvertical probe assembly formed by assembling units in the X and Ydirections on the supporting board. FIG. 12 is a partial perspectiveview showing a mounting stand serving as the supporting stand 13 of amultiple array vertical probe assembly (showing only the framework partactually in the process of construction). As this figure shows, themounting stand 13 on which the units in the X and Y directions 5 and 6will be mounted consists of a supporting board (not shown. This is aboard laid out below the props 8.) and a plurality of props 8 erected onthis supporting board. The props 8 are erected separately at fourcorners of the crossing area 100 of the unit in the X direction 5 withthe unit in the Y direction 6, and each of the props 8 is arranged insuch a way as to be able to support the unit in the X direction 5 andthe unit in the Y direction 6 for the adjacent crossing area 100. Theprop 8 is made up of a rod with a rectangular section of a predetermineddimension as shown in FIG. 13 and FIG. 14, and its upper part is notchedfrom the top surface downward and has a first groove 51 and a secondgroove 52 mutually crossing at the right angle as shown in details inFIG. 14. The first groove 51 is a groove cut relatively shallowly, andthe second groove 52 is a groove hollowed out more deeply than the firstgroove 51. With regard to the first groove 51, the props 8 are erectedat a predetermined interval so that the first groove 51 may itselfextend in the Y direction. And the first groove 51 is fitted with asquare bar 8 a (see FIG. 12 and FIG. 13). And with regard to the secondgroove 52, the props 8 are erected at a predetermined interval so thatthe second groove 52 may itself extend in the X direction. The secondgroove 52 is fitted with a square bar 8 b (see FIG. 12 and FIG. 13). Thesupporting board and the prop 8 are, like the square bars 8 a and 8 bdescribed above, made up of a non-conductive material or a materialcoated with an insulating material. In particular, the supporting boardis preferably made of silicon or a material having a thermal expansionrate similar to that of silicon so that the supporting board may be ableto cope with burn-in tests.

The plurality of props 8 are erected in the matrix form on thesupporting board so that the pitch of erecting the props 8 in the Xdirection may be p1 and the pitch in the Y direction may be p2.

So far, the structure of the multiple array vertical probe assembly hasbeen described for each block constituting the same, and the followingis the description of the process of assembling these blocks.

To begin with, examples of dimensions of various components will beshown so that they may serve as the yardstick of evaluating the size ofthe whole multiple array vertical probe assembly. The ribbon-shapedfilms 1 and 2 as described above consist of, for example, a polyimidefilm approximately 12 μm thick coated with a beryllium copper foil 20-30μm thick and on this film the vertical probes 3 and 4 and wiring lines39 and 43 are patterned. Now, supposing that 10 mm square semiconductorchips are arranged in the X-Y directions on a wafer to be tested, itwill be understood that the width of the units in the X and Y directions5 and 6 respectively consisting of a plurality of ribbon-shaped films 1and 2 can be approximately 9 mm wide at the maximum. And supposing thateach prop 8 erected on the ribbon-shaped film in the X direction 1adapted to a 10 mm pitch is 0.6 mm square (as shown in FIG. 14), andthat the width in the vertical direction for letting a wiring line passin the longitudinal direction of the ribbon-shaped film in the Xdirection 1 (dimension of gap between a wiring line and another wiringline) is 0.2 mm, the opening 9 can be 9 mm wide at the maximum. Thismeans that, supposing that a ribbon-shaped film in the X direction 1 is40 μm thick, 225 ribbon-shaped films in the Y direction can bemathematically arranged within 9 mm and made to pass through the opening9. However, actually their number will be determined according to thenumber of pads in a line on a chip.

Regarding the mounting stand 13 shown in FIG. 12, the dimensions of thesupporting board are set at nearly the same values as those of the waferto be tested, and the props 8 are erected according to the number ofchips in such a way that four props 8 may represent the area of a chip.And as an example, their pitch is set at p1=p2=10 mm, and the height ofthe prop 8 is set at a level that removes the possibility of the lowerside of the ribbon-shaped film in the X direction 1 touching thesupporting board when the units in the X and Y directions 5 and 6 aremounted.

To begin with, a plurality of sets of units in the X direction 5assembled in advance by inserting successively square bars 8 a in thesquare hole 10 a of a plurality of ribbon-shaped films in the Xdirection 1 are arranged in parallel by adjusting their pitch, and bothends of a square bar 8 a are fitted into the first groove 51 of twoprops 8 erected at intervals in the Y direction, and are mounted betweenthe two props 8. Then, a ribbon-shaped film or films in the Y direction2 is or are inserted from the Y direction at the right angle into theopening 9 of each film 1 of a unit in the X direction 5. This insertionmay be made by a ribbon-shaped film or films in the Y direction 2 one byone at a time, or by a plurality of them corresponding to a unit. Whenthe insertion of ribbon-shaped films 2 is completed, a square bar 8 b isinserted successively into the square holes 10 a of ribbon-shaped films2. Both ends of the square bar 8 b are fitted into the second groove 52of two props 8 erected at sparse intervals in the X direction, and aremounted between the two props 8. As the second groove 52 of the prop 8is cut deeper than the first groove 51, the height of erecting thesquare bar 8 b is set at a lower position than the height of erectingthe square bar 8 a. This creates a difference in level between the unitin the X direction 5 and the unit in the Y direction 6 (see FIG. 12 andFIG. 13). In this way, a block of units in the X and Y directions 5 and6 is assembled in the grid form.

The following is a description of the method of correctly positioningthe top of probes at the target positions even if there is a variationin the thickness direction of lamination of the ribbon-shaped film inthe Y direction 2 to be laminated with reference to FIG. 10 and FIG. 11.For assembling the unit in the Y direction 6 described in FIG. 10, theribbon-shaped films in the Y direction 2 are inserted into the opening 9of a ribbon-shaped film in the X direction 1 to be fixed there, and asquare bar 8 b is inserted into the opening 10 a of the ribbon-shapedfilms in the Y direction 2. Each square bar 8 b has protrusions 47, andwhen the width dimension of the opening 10 a is small, the protrusions47 serve as stoppers of inserting movement between the ribbon-shapedfilm in the Y direction 2 and the square bar 8 b and cause the squarebar 8 b to come to a full stop. The positions of the protrusions 47correspond with the positions for the probe contact point 38 to bepositioned, and the presence of a plurality of protrusions 47 in asquare bar 8 b enables to prevent important positional displacement bycorrecting the accumulated positional displacement (positional shift inthe direction of putting together) resulting from variations in thethickness of the ribbon-shaped film in the Y direction 2 within therange of pitch of the protrusions 47 and to bring the top of probes topositions correctly corresponding to those of the pads in the wafer.

Apart from the problem of preventing the positional shifts describedabove, when a square bar 8 b is inserted into the opening 10 a of theribbon-shaped film 2 in the Y direction 2, a shelf part 49 provided andextending in the longitudinal direction of the square bar 8 b comes intocontact with a protrusion 44 formed on the vertical probe 4 of theribbon-shaped film in the Y direction 2 and plays the role of supportingfrom below the vertical probe 4. And the top of the protrusion 44 andthe square bar 8 b are joined together when the top of the protrusion 44strikes against the side surface of the square bar 8 b, resulting in thepositioning of each ribbon-shaped film in the Y direction 2 in thelongitudinal direction. This action of the top of the protrusion 44coming into contact with the side surface of the square bar 8 b has theeffect of not only positioning in the longitudinal direction asmentioned above but also of preventing any positional shifts of thevertical probe 4 due to the thermal expansion of the ribbon-shaped filmin the Y direction 2 during a burn-in test.

The above points are similar with regards to the ribbon-shaped film inthe X direction 1 and the unit in the X direction 5 constituted by thesame.

Then, the block of these units in the X and Y directions 5 and 6assembled in the grid form is placed on the supporting board. In thisway, the units in the X and Y directions are fixed with the supportingboard, completing a multiple array vertical probe assembly. In addition,as the units in the X and Y directions 5 and 6 are vertically positionedby the first groove 51 and the second groove 52 formed in the prop 8, itis possible to level the height of the top 32 and 42 of the verticalprobes 3 and 4.

According to the present Embodiment 2, as the units in the X and Ydirections are fixed on the props in the grid form, even ifribbon-shaped films expand due to differences in temperature, thethermal expansion is absorbed within the unit corresponding to a chipand does not affect the adjacent units, and thus the whole expansion canbe contained. As a result, any shift in pitch between the chip pads andthe vertical probes is eliminated and it will be possible to measureproperty by using a multiple array vertical probe assembly.

FIG. 15 is a view showing the wiring structure at a film end of thewiring lines 39 and 43 formed on the ribbon-shaped films in the X and Ydirections 2. The wiring structure shown in FIG. 15 enables theterminals 61 a, 61 b, 61 c, 61 d, 61 e and 61 f created on the printedwiring board 61 and the terminals for the ribbon-shaped films in the Ydirection 2 to arrange the ribbon-shaped films in the Y direction 2 atfine intervals. However, due to coarse intervals between terminals onthe printed board 61, the establishment of correspondence one againstanother between the ribbon-shaped film in the Y direction 2 and theterminals 61 a, 61 b, 61 c, 61 d, 61 e and 61 f of a printed board 61enables to avoid the necessity of making a large variety ofribbon-shaped films in the Y direction 2. In this case, spring deformingterminals not requiring electric conduction should be insulated. Thewiring structure of the present invention provides a means of conductingby contact between the terminals on the printed board 61 and theterminals of the ribbon-shaped films in the Y direction 2 withoutsoldering. The wiring 43 a includes a plurality of spring deformableterminals 43 b (three terminals in the example of FIG. 15). The wiring43 c also includes a plurality of spring deformable terminals 43 d. Evenif the intervals among the terminals 61 a, 61 b, 61 c, 61 d, 61 e and 61f on the printed board 61 are coarse, resilient terminals of a pluralityof terminals 43 b to 43 d of the ribbon-shaped films in the Y direction2 arranged by a fine pitch are used for electric conduction. Since theyare resilient terminals, a pressure applied from above (not shown) onthe ribbon-shaped films in the Y direction brings the resilientterminals into contact with the terminals on the printed board with anearly uniform contact pressure.

Embodiment 3

The following is a detailed description of the Embodiment 3 of thepresent invention with reference to drawings. FIG. 16 is a front viewshowing an example of the ribbon-shaped film according to the Embodiment3 of the present invention. The Embodiment 3 of the present inventiontakes care to drastically simplify the structure of the ribbon-shapedfilm in the X direction or the ribbon-shaped film in the Y direction.Specifically, in the present Embodiment 3, the film material of theribbon-shaped film 65 is curtailed to the limit and the ribbon-shapedfilm 65 consists of a first connecting member 67 a connecting a verticalprobe pair 66 consisting of a pair of vertical probes mutually facingeach other 66 a and 66 b, a second connecting member 67 b connectinganother vertical probe 66 c positioned behind a vertical probe (forexample 66 a) and wiring lines 68 extending downward from the verticalprobes 66 a, 66 b and 66 c. The wiring lines 68 form openings 69 bybending at a predetermined position below the vertical probes 661, 66 band 66 c, and have the general structure similar to the ribbon-shapedfilm in the X direction 1 in the Embodiment 2 described above.

The adoption of such a structure enables to realize a probing device ofa simpler structure.

As described above, as the present invention provides a structure offixing the whole after arranging the units in the X and Y directions inthe grid form and positioning the same, it is possible to contain theexpansion of the whole structure even if the ribbon-shaped film mayexpand due to differences in temperature. As a result, any shift inpitch between the chip pads and the vertical probes will be eliminatedand it will be possible to measure characteristics by means of amultiple array vertical probe assembly.

Embodiment 4

The following is a description in details of the Embodiment 4 of thepresent invention with reference to drawings. FIG. 17 is a perspectiveview of a test piece according to the Embodiment 4 of the presentinvention, and FIG. 18 is a side view of a probe in Embodiment 4. FIG.17 and FIG. 18 show the case of a probing device wherein the elements ofthe probe 101 consist of an electric conducting part 102 and a film part103. By arranging the elements of this probe 101 in various directions,it is possible to make a memory-related chip or the like correspond tothe pad of a line or a plurality of lines. In other words, by arranginga plurality of layers of probe 101 at an appropriate pitch horizontallyfacing the paper surface and by arranging a plurality of layers in thedirection of depth facing the paper surface, it is possible tocorrespond to the arrangement of pads of a plurality of lines. The term“probe” used here means a contact by which electric contact providescontact force accompanied by resilient deformation, and is not limitedto probes used only in the probing device for testing LSI circuitsgenerally referred to. Similarly, the term “probing device” meansdevices providing electric contacts. This definition applies likewisehereafter.

In FIG. 17, the code 600 represents a wafer. The code 601 represents achip arranged on a wafer, and the code 602 represents a pad arrangedwithin a chip. The contact 1 described below is particularly effectivewhen it is applied to the tests of semiconductor wafer on which the chip601 contains the pads 602 arranged in a line. The probe 101 of thepresent invention is effective when the test of similar arrangement isnecessary not only for testing semiconductor wafers but also for testingliquid crystal.

FIG. 18 shows the arrangement relationship of component parts related tothe electric conductive part 102 and the film part 103. The electricconductive part 102 is made up of conductive materials and includes aninput part 501 to be brought into contact with the electrode pads ofchips to be tested, a deforming part 502, a fixing part 503, an outputdeforming part 504 and an output part 505. The deforming part 502contains an arc in its outline, and the presence of an arc far from theinput part 501 and the fixing part 503 results in an important amount ofdeformation. When a round bar 104 coated with insulating material isinserted into the arc of the fixing part 504 and the pad 602 is broughtinto contact with the input part 501, the fixing part 503 is fixedcausing the deforming part 502 to deform, and its restoring forcebecomes the contact force between the pad 602 and the input part 501.

The electric conductive part 102 in the present invention ischaracterized in its fixing part 502 and output deforming part 504. Theround bar 104 is inserted into the fixing part 503 and the insertedround bar 104 is supported by a fixing plate 105. A wiring assembly 106is stuck on the fixing plate 105, and one end of the line extendingvertically of the wiring terminal 106 enters into contact with theoutput part 505 resulting in the conduction of current. The outputdeforming part 504 also contains an arc, and when it enters into contactwith a wiring terminal, it deforms and the restoring force of the outputdeforming part generates contact force.

When the wiring terminal 106 and the output part 505 are brought intocontact while the output deforming part 504 is deformed to anappropriate extent, stable electric connection can be achieved. InEmbodiment 4 of the present invention, the output deforming part 504includes an arc. However, the form of means of generating resilientdeformation is not particularly limited to arcs.

An auxiliary pattern 107, subject to the action of symmetrical force,serves to facilitate the insertion of pressure of the round bar 104 andalso to increase at the same time the effect of fixing the fixing part503.

The electric conductive part 102 and the auxiliary pattern 107 adhere onthe surface of the film part 103. Various holes 510 are cut out insidethe deforming part 502 so that the deforming action of the deformingpart 502 in the electric conductive part 102 may not be obstructed.Holes 510 cut out in the film part 103 decrease wrinkles that maydevelop in the film part 103 when the deforming part 502 has deformed.Holes 108 of a diameter similar to that of the round bar 104 are cut outin the position of inserting the round bar 104 of the fixing part 503.

In the process of testing LSI circuits, when the pads 602 have shifteddownward facing the paper surface until an appropriate contact forceacts between the pad 602 and the input part 501 and at the same time theinput part 501 also shifts downward. At this time, the deforming part502 has deformed. When contact force acts and the restoring force of thedeforming part 502 acts, the force of pushing down the round bar 104from the fixing part 503 acts upon the upper main body of the round bar104. As the lower end of the round bar 104 is in contact with the fixingplate 105, the length of the fixing plate 105 in the vertical directionis as short as any flexion resulting from any contact force to which itmay be subjected is negligible, and the round bar 104 does not bend.When contact force acts, in the fixing part 503 there is a vector offorce acting in the right and left directions due to contact force.However, no particular problem arises as the electric conductive part102 adheres to the film part 103.

Therefore, as described above, the pads 602 and the input part 502 arein contact accompanied by contact force while the fixing part 503 isfixed, and the pads 602 and the wiring terminals 106 can obtain goodelectric conductivity.

Embodiment 5

The following is a detailed description on Embodiment 5 of the presentinvention with reference to drawings. FIG. 19 is a perspective view oftest pieces related to Embodiment 5 of the present invention, and FIG.20 is a side elevation of a probe according to Embodiment 5. Embodiment5 relates to the case where the elements of the basic vertical probe 101consist of two electric conductive parts 102 and the film part 103. Thearrangement in various directions of the elements of this probe 101enables to cope with the chips 601 with adjacent two-line arrangement,opposite two-line arrangement of pads 702, ASIC or logic, or arrangementin rectangular form of the pads 702.

FIG. 20 shows the structure in case where two probe parts are arrangedfacing each other. The left-side probe part is arranged in a state ofreplacing the auxiliary pattern 107 described in Embodiment 4, and twoinput parts 501 and 501 face against the pads 602 on the left side andthe right side of two adjacent chips.

The arrangement of the elements of this probe 101 in various directionsenables to correspond with a line or a plurality of lines of pads for amemory-related chip or the like. In other words, the horizontalarrangement of a plurality of layers of probes 101 at an appropriatepitch facing the paper surface, and the arrangement of a plurality oflayers in the depth direction facing the paper surface allowcorrespondence to the arrangement of a plurality of lines of pads. Inaddition, the arrangement at the right angle of approximately similararrangements allows correspondence to the chips 601 with the rectangulararrangement facing the pads 602 of ASIC or logic described above inorder to face the remaining pads with rectangular arrangement on the twoside.

There are the wiring terminals 106 on both sides of the fixing plates105, which enable two probes 101 to establish electric conductivitybetween them.

The functions of the input part 501, the deforming part 502, the fixingpart 503, the output deforming part 504, and the output part 505 of theelectric conductive part 102 in the present Embodiment 5 are nearly thesame as Embodiment 4.

Therefore, the arrangement of Embodiment 5 and two wiring terminalssandwiching the fixing plate 105 correspond to the adjacent chip 601,and constitute an effective arrangement enabling the rectangulararrangement-type pad arrangement to obtain electric conductivity.

Embodiment 6

The following is a detailed description of Embodiment 6 of the presentinvention with reference to drawings. FIG. 21 is a front view of a probe603 according to the present Embodiment 6, FIG. 22 is a side elevationof the probe 603, FIG. 23 is a front view of a ground line pattern 604,FIG. 24 is a front view of a film 605. The present Embodiment 6 isdesigned to cope with the requirement for higher speed. Incidentally, asfor the corresponding chips, like Embodiment 4, the arrangement of theelements of this probe 603 in various directions enables amemory-related chip or the like to correspond to a chip arrangementhaving a line or a plurality of lines of pads. Since the wiringterminals and the fixing plate according to the present Embodiment 6 canbe applied according to the nearly same principles and functions asthose of the wiring terminals 106 and the fixing plate 105 described inEmbodiment 4, their description in the present Embodiment is omitted.

Generally, attempts to secure contact force by taking advantage of theform of materials having a large sectional secondary moment of arectangular section results in an expansion of the width of the material(vertical dimension on the paper surface). This runs counter to therequirement for higher speed, since any attempt to accumulate contactsin the direction of multiple layers (in the vertical direction on thepaper surface) increases electric capacity. On the other hand, contactsrequire an adequate contact force. The present Embodiment provides amethod for securing contact force while reducing the width of materialof the electric conductive part, a method involving the ground linepattern 604 related to force wherein an electric conductive part 606plays a part relating to electric conductivity. Incidentally, theelectric conductive part 606 and the ground line pattern 604 are linkedby the film 605, and the two members, the electric conductive part 606and the ground line pattern 604, enable to maintain electric insulationwhile being linked by a part K where the force of FIG. 23 is transmittedmechanically.

FIG. 21 describes the electric conductive part 606 by a solid line. Inthis electric conductive part 606, the code 607 represents an inputpart, 608 represents a deforming part, 609 represents a fixing part, 610represents an output deforming part and 611 represents an output part.The main functions of the electric conductive part 606, having a nearlysame structure as that of the electric conductive part 102 described inEmbodiment 4, are nearly the same. However, it is different in that theline width of each part and the distance from the round bar 104 aresmaller. In the middle of the input part 607, the electric conductivepart 606 is mechanically connected with the ground line pattern 604through the film 605. In other words, the surface of the ground linepattern 604 is mechanically connected with the film 605, and theelectric conductive part 606 is mechanically connected with the inputpart 607 in the vicinity of the fixing part 609.

Upon having moved below the pads (not shown) and having pushed down theinput part 607, in the oblique line part K shown in FIG. 23, theelectric conductive part 606 and the film 605 integrate and move in thesame way. The force acting as contact force is nearly the sum of therestoring force generated by the respective deformation of the deformingpart 621 of the ground line pattern 604 and the deforming part 608 ofthe electric conductive part 606. However, in the present Embodiment, asdescribed above, due to the possibility of coping with a small stresswith the deforming part 608 of the electric conductive part 606 having asmall sectional secondary moment, the impact of the width of materialplaying a part in the sectional secondary moment is significant, andeven if the deforming part 621 of the ground line pattern 604 is outsideof the deforming part 608 of the electric conductive part 606, contactforce is generated mostly by the restoring force of the ground linepattern 604. This enables to miniaturize the electric conductive part606 and at the same time to obtain a large vertical movement of theinput part 607 and the optimum contact force.

As it is possible to widen and narrow only the part getting into contactwith the top of pads of the input part 607 by using a partial etchingtechnique or a partial plating technique, it is possible to achieve thetechnical purpose by choosing these techniques as required depending onthe usage required.

FIG. 22 is the right-side view of FIG. 21, showing the electricconductive part 606 on which the film 605 and the insulating film 612are pasted. The film 605 is pasted on the surface of the ground linepattern 604. As described above, the contact force applied on the inputpart 607 results in the transmission of force shown by the arrow F inFIG. 22, and the round bar 104 supports the contact force. In otherwords, the contact force applied to the input part 607 of the electricconductive part 606 is transmitted from the electric conductive part 606to the film 605 and the ground line pattern 604 (as shown by the arrowF2 in FIG. 22), and is supported by the resilient deformation of thedeforming part 608 of the electric conductive part 606 and the deformingpart of the ground line pattern 604 together with the film 605. As forthe conduction of electric signals, the electric signals inputted intothe inputting part 607 of the electric conductive part 606 pass throughthe electric conductive part 606 for their transmission (as shown by thearrow F2 in FIG. 22).

In FIG. 23, the round bar 104 is pressure fitted into an arc part 623 ofa fixing part 622 of the ground line pattern 604. The protruding part622 of a deforming part 621 and a protruding part 624 on the left sideare connected respectively when they are arranged in a plural numberhorizontally at a predetermined pitch. Therefore, even if the groundline pattern 604 is not connected with the wiring ground, it is possibleto connect it with the ground at suitable points. For example, thearrangement of terminals similar to the deforming part 609 at pointswhere ground connection is required enables to connect with the ground.In FIG. 23, this is omitted because it is within a range of easyassumption.

FIG. 24 shows the film 605. This film 605 has nearly the same functionsas that of Embodiment 4, and is respectively mechanically connected withthe electric conductive part 606 and the ground line pattern 604. In themeanwhile, the film 605 includes a hole 613 corresponding to the hole510 of Embodiment 4 and a hole 614 for inserting the round bar 104.

FIG. 25 shows an insulating film 612 pasted on the electric conductivepart 606. This insulating film 612 must be respectively in an insulatedstate when the probes 603 are arranged in the thickness direction. Bypasting this insulating film 612 in such a way that they may encirclethe electric conductive part 606 except in the vicinity of the positionswhere the inputting part 607 is in contact with the pads and in thevicinity of the positions where the output part 611 is in contact withthe wiring terminals 106, the respective electric conductive part 606will have an electrically independent structure. Incidentally, theinsulating film 612 includes a hole 615 corresponding to the hole 613 ofthe film 605 and a hole 616 for inserting the round bar 104.

Embodiment 7

FIG. 26 is a front elevation of the electric conductive part 606 in theprobe 603 representing Embodiment 7. FIG. 27 is a side elevation of theelectric conductive part 606 in the probe 603. The present Embodiment 7increases the distance of standing opposite of the electric conductivepart and reduces electric capacity in order to cope with the effortstowards higher speed of the probes 603. FIG. 26 describes only electricconductive parts 606-1 and 606-2 adjacent to the contacts 300 piled upin the thickness direction in the form of a front view, and shows thestate where no contact force is in action.

When the respective input parts of the electric conductive part 606-1and the electric conductive part 606-2 are represented by 607-1 and607-2, the length in a vertical direction L1 of this input part 607-1and the length in a vertical direction L2 of the input part 607-2 aredifferent, and if a deforming part 608-1 and a deforming part 608-2 haveapproximately the same form, the opposite overlapping as seen in thefront view will be small, and therefore as shown in FIG. 26 the oppositearea in the electric conductive part 606-1 and the electric conductivepart 606-2 will be small. As a result, according to the presentEmbodiment 7, it will be possible to assemble contacts having a smallelectric capacity and corresponding to the requirement for higher speed.In the meanwhile, the method of the present Embodiment 7 may be appliedto Embodiment 4, Embodiment 5, and Embodiment 6.

Embodiment 8

FIG. 28 is a front elevation of probe 603 representing Embodiment 8 ofthe present invention. FIG. 29 is a front view of its ground linepattern 604. Embodiment 8 shown in FIG. 28 and FIG. 29 represent thecase wherein the electric conductive part 606-1 and the electricconductive part 606-2 are arranged symmetrically horizontally. Thearrangement of these elements in various directions enables tocorrespond to the chips 601 having adjacent two-line arrangement,opposite two-line arrangement and having the pads 602 being arranged inthe rectangular form such as ASIC, logic and the like as shown in FIG.19.

FIG. 28 is an illustration of the case wherein two electric conductiveparts 606 are symmetrically arranged horizontally and of having thecommon ground line pattern 604, the common film 605 and the insulatingfilm 612. The two input parts are facing the pads 602 on the left sideand the right side of two adjacent chips.

By arranging horizontally at a suitable pitch and arranging multiplelayers in the depth direction facing the paper surface, it will bepossible to correspond to the arrangement of a plurality of chips havingtwo lines facing each other of a rectangular pad pattern. Moreover, byarranging approximately same arrangement crossing at the right angle tocorrespond to the remaining rectangular arrangement of pads on twosides, it will be possible to correspond to a rectangular arrangement ofthe chips 601 facing the pads 602 such as ASIC, logic and the samedescribed above.

There are the wiring terminals 106 on both sides of the fixing plate105, and they enable two probes 102 and 102 to gain electricconductivity.

The function of the input part 607, the deforming part 608, the fixingpart 607, the output deforming part 610, and the output part 611 of theelectric conductive part 606 in the present Embodiment 8 are nearly thesame as Embodiment 4. In addition, FIG. 30 shows an output deformingpart 604 a of the ground line pattern 604 in case where the ground linepattern 604 is connected with the ground line of wiring. Furthermore,the film and the insulating film in the present Embodiment are identicalin form on the right side and the left side of FIG. 24 and FIG. 25, andseem to be assumable. Therefore, their drawings and description areomitted.

Therefore, the arrangement of the present Embodiment 8 and the twowiring terminals 106 sandwiching the fixing plate 105 correspond to theadjacent chips 601 shown in Embodiment 5, and are effective arrangementsfor enabling the rectangular arrangement type pad arrangement to gainelectric conductivity at a high speed.

The adherence to the descriptions made on the ground line pattern, filmand insulating film in the present Embodiment 8 enables anyone to obtainelectric conductivity by high-speed contact with pads arranged in therectangular form.

Embodiment 9

Embodiment 9 of the present invention will be described with referenceto FIGS. 31 to 35. FIG. 31 is a perspective view showing the probe partof a probe assembly in Embodiment 9 of the present invention. FIG. 32 isa schematic representation of the probe part shown in FIG. 31 as seenfrom the side and indicates the path of electric signals. FIG. 33 is afront view of a probe representing Embodiment 9 of the presentinvention. FIG. 34 is a front view of its ground line pattern. FIG. 35is a front view of the film representing Embodiment 9 of the presentinvention.

The method of electric connection adopted in Embodiment 9 is differentfrom the method of electric connection adopted in Embodiment 6 orEmbodiment 8. In other words, in Embodiment 6 and the like, the top (607in FIG. 22) of the electric conductive part 606 enters into contact withpads to be subjected to a contact force (F) and is electricallyconnected (see FIG. 22). Embodiment 9, on the other hand, adopts themethod of the electric conductive part not touching pads and ofreceiving contact force by the contact between a ground line pattern604-1 and the pads and connecting electrically. This method ofEmbodiment 9 is superior because, when the thickness of pattern of aelectric conductive part 102-1 has become extremely thin to the level ofseveral μm and its resiliency has become small, accepting contact forcethrough connection with the pads does not lead to the deformation anddestruction on the side of the ground line pattern.

As shown in FIG. 31, a probe 603-1 according to the present Embodiment 9is composed of an electric conductive part 102-1, a film 605-1, and aground line pattern 604-1. The ground line pattern 604-1 is made up ofmetals and other conductive materials and includes a contact part 621-1,a top part 621-2, a notch 621-3. The electric conductive part 102-1 isobviously made up of metals and other conductive materials, and includesa reinforcing pattern 102-3 and a top part 102-2. The top part 102-2 ofthis electric conductive part 102-1 is jointed metallically with the toppart 621-2 of the ground line pattern 604-1. The reinforcing pattern102-3 serves as a means of reinforcing the metallic junction byincreasing the connecting area.

The electric conductive part 102-1, the film 605-1, and the contact part621-1 of the ground line pattern 604-1 are solidly jointed by adepositing means, a plating means and the like. When a contact force isgenerated by the connection between the pads and the top part 621-2 ofthe ground line pattern 604-1, this contact force is inputted as shownby the arrow A in FIG. 32, and is then transmitted as shown by thearrows A1, A2 and A3. In other words, the inputted contact force (arrowA) is transmitted from the top 621-2 of the ground line pattern 604-1 tothe top part 102-2 of the electric conductive part 102-1 (arrow A1),then it is transmitted from the electric conductive part 102-1 to thefilm 605-1 (arrow A2), and further transmitted from the film 605-1 tothe ground line pattern 604-1 (arrow A3). By this, the deforming part(code 621-4 in FIG. 34) of the ground line pattern 604-1 is resilientlydeformed. The contact force shown by the arrow A3 is transmitted to thebase going beyond the notch 621-3 as seen from the top part 621-2 of theground line pattern 604-1. For this reason, while contact force istransmitted as described above, electric signals are interrupted by thenotch 621-3 and the film 605-1 (made of an insulating material) and doesnot pass through the ground line pattern 604-1.

The following is a description on the conduction of electric signals inthe present Embodiment 9. As shown in FIG. 32, electric signals areinputted as shown by the arrow A and are then transmitted by the arrowsA1 and A4. In other words, the electric signals inputted (arrow A) aretransmitted from the top part 621-2 of the ground line pattern 604-1 tothe top 102-2 of the electric conductive part 102-1 (arrow A1), and passthrough the electric conductive part 102-1 to be sent to the outputdeforming part (code 102-4 in FIG. 33). As described already, as theground line pattern 604-1 includes a notch 621-3, electric signals donot arrive at the deforming part of the ground line pattern 604-1.

According to the present Embodiment, it is possible to input from theground line pattern the electric signals coming from the pads, andtransmit them to the electric conductive part 102-1 for electric tests.

Embodiment 10

FIG. 36 is a descriptive illustration of the method of avoidinginterference in the probes 603 as described in Embodiment 10. Whenprobes are arranged in a rectangular form as in ASIC or logic, probescross or cross at the right angle in the present invention. Interferenceis avoided in this case under the condition that A, B, C and D of thetwo electric conductive parts 606 in FIG. 36 are respectively same. Thisenables to adopt the same fixing method because of the same distancebetween the fixing plate 105 to the upper surface of the round bar 104.The electric characteristics of the electric conductive part are nearlythe same.

The following is a description on the electric wiring structure of themultiple array probe assembly according to the present invention thusconstituted with reference to FIGS. 37 to 45.

FIG. 37 is a perspective view showing a part of the related electricwiring structure. This electric wiring structure has important functionsfor receiving and transmitting electric signals by connectingsemiconductor chips to be tested and the main body of the probingdevice.

As shown in FIG. 37, this electric wiring structure consists ofribbon-shaped films 707 and 708 having wiring patterns formed byberyllium copper or the like on both sides of polyimide resin or otherinsulating films, and is constituted by assembling in the X and Ydirections two sheets respectively of these ribbon-shaped films 707 and708. The ribbon-shaped film 707 includes notches 771 at a plurality ofpositions at a pitch P, and the ribbon-shaped film 708 includes notches781 in the same way. The width of each notch 771 and 781 is equal to theinterval between pedestals. These notches enable the ribbon-shaped films707 and 708 to be combined in the X and Y directions in the grid form,and these ribbon-shaped films 707 and 708 are arranged in the intervalsbetween pedestals to enable electric connections among separate probeassemblies. Incidentally, the ribbon-shaped films 707 and 708 both inthe X and Y directions are arranged by groups of two sheets in theintervals between pedestals. The structure of these ribbon-shaped filmshaving wiring patterns will be described in concrete terms withreference to FIGS. 38 and 39.

FIG. 38 is an illustration showing the structure of a ribbon-shaped filmin the X direction, and FIG. 39 is an illustration showing the structureof a ribbon-shaped film in the Y direction. In each figure, A is a sideelevation and B is a front elevation. As shown in FIG. 37, theribbon-shaped film 707 includes a plurality of notches 771 in theshorter side direction of the film matching the arrangement pitch P ofprops, and similarly the ribbon-shaped film 708 includes notches 781from the opposite direction of the ribbon-shaped film 707. Notches aremade to a depth equivalent to the approximate center of the film, andthe width of each notch is equal to the interval between pedestals. Andthe length of each of the films 707 and 708 is a length that can coverthe length of maximum arrangement in the X or Y direction of chipsformed on a wafer. The ribbon-shaped film in the X direction 707 and theribbon-shaped film in the Y direction 708 have somewhat differentstructure of wiring pattern.

In the first place, the ribbon-shaped film in the X direction 707 shownin FIG. 38A includes a plurality of copper wiring lines 772 formed inparallel vertically at a narrow pitch (for example 45 μm) on the upperhalf (h/2) side without notches 771 on the surface side. This narrowpitch interval coincides with the pitch of vertical probes of individualarray probe assembly. On the other hand, on the back side of this film707, a plurality of common copper wiring lines 773 crossing at the rightangle with the copper wiring lines 773 are formed on the upper half(h/2) side without notches 771 in parallel with the longitudinaldirection of the film, and the copper wiring lines 772 and the commoncopper wiring line 773 are electrically connected between both sides ofthe film 707 through the through-holes 774 cut out in the film 707. Thecommon copper wiring line 773 is, like the copper wiring lines 772, madeby the etching method or the plating method using the photolithographytechnique. Since the copper wiring line 772 and the common copper wiringline 773 are separately made on both sides of the film, thethrough-holes 774 for connection need to be cut out only at crossingpositions required for connection, and there is no need for shield atother crossing points. Thus, the wiring patterns consisting of thecopper wiring line 772 and the common copper wiring lines 773 formed onthe ribbon-shaped film in the X direction 707 take the form of thecopper wiring lines 772 branching out for each section constituted bythe interval P between the adjacent notches 771 and 771 from the commoncopper wiring line 773 serving as the common line.

On the other hand, the ribbon-shaped film in the Y direction 708 has, asshown in FIGS. 39A and 39B, copper wiring lines 782 formed over thelength reaching the lower half (h/2) of the surface side of the filmhaving a width h and common copper wiring line 783 formed in the lowerhalf (h/2) of the back side, and the respective wiring lines areconnected through through-holes 784 between the both sides of the filmlike the ribbon-shaped film in the X direction 707. However, due to theposition of the notches 781 cut out facing upward, the common copperwiring line 783 is arranged in the lower half of the film free ofnotches, and the length of the copper wiring lines 782 is extended tothat extent. The ribbon-shaped film thus formed covers the whole filmincluding the copper wiring lines and the common wiring line with a thininsulating coating and protects the surface to prevent the copper wiringlines from pealing off and shorting. However, if the pedestals and thepositioning bars in the X and Y directions described below (FIG. 41 andFIG. 42) are made of resin, it is needless to use insulating film.

The top part of the copper wiring lines 772 and 782 protrudes slightlyfrom the upper side in the longitudinal direction of the film (shown bythe dimension a in FIG. 38 and FIG. 39), and these protruding topsconstitute contact terminals 775 and 785 for entering into contact withthe top of vertical probes when the multiple array probe assembly isassembled by exposing the copper surface. As the common copper wiringlines 773 and 783 can be connected with outside testing devices througha socket 715 because, as the perspective view of FIG. 45 shows, the endof the ribbon-shaped films 707 and 708 can be inserted into the socket715.

FIGS. 47 to 49 are illustrations showing an example of application ofthe ribbon-shaped film in the Y direction 708 shown in FIG. 39, and FIG.47 is a perspective view, FIG. 48 is a front view and FIG. 49 is asectional view. This is different from FIG. 39 in that the verticalcopper wiring lines 782 extend to the lower side of the ribbon-shapedfilm by going over the crossing point with the horizontal common copperwiring line 783, and protrude slightly from the lower side to serve asconnecting terminals 785 c on the lower side. As this arrangementresults in the formation of connecting terminals on the upper and lowersides of the ribbon-shaped film, it is possible to use the connectingterminals even if the upper and lower sides are reversed. Similarly, itis possible to expand the scope of application of the ribbon-shaped filmby providing connecting terminals on the lower side of the ribbon-shapedfilm in the X direction.

FIG. 46 is an illustration showing an example of connection between thewiring lines of the ribbon-shaped film and a wafer. In other words, twoinput signal lines 863 and 864 and an output signal line 865 areprovided as the common copper wiring lines. As these signal lines areconnected, for example, in common with a plurality of chips 862 arrangedin the X direction on a wafer 861, it is possible to test each line atthe same time. The type and number of these signal lines may be setfreely, and it is easy to exchange ribbon-shaped films as required.

The ribbon-shaped films in the X and Y directions thus formed are fixedon a multiple array mounting stand. The component parts required thenwill be described with reference to FIGS. 34, 35 and 36. FIG. 40 is atop plan view showing a part of the multiple array mounting stand. Inother words, the positioning bar in an X direction 709 and thepositioning bar in a Y direction 710 are combined in the grid form to befixed in the interval c between pedestals 703 arranged at a pitch P inthe X and Y directions. The positioning bar in the X direction 709 andthe positioning bar in the Y direction 710 are positioned and fixed inthe X-Y-Z direction by passing props 706 (diameter d) into holes cut outat respective crossing points when they are combined. The thickness f ofthis positioning bar in the X direction 709 and the positioning bar inthe Y direction 710 is f>d because of necessity of passing props 706,and is set in such a way that f=c−2 g by leaving a width g into whichthe ribbon-shaped film 707 or 708 described above may be inserted onboth sides thereof. Their width g is set in such a way that the value oftheir thickness including the copper wiring lines 772, 773 or 782, 783formed on both sides of the ribbon-shaped films 707 and 708 may beinserted.

FIG. 41 is a perspective view showing the structure of the positioningbar in the X direction 709 and the positioning bar in the Y direction710. The positioning bar in the X direction 709 and the positioning barin the Y direction 710 are long plate-shaped bar made of resin or metalmaterials having a thickness h and a width f. A plurality of notches 792having a width c and a depth h/2 are formed on the lower side at a pitchP, and a hole 791 is cut out at the central position of each of thenotches 792 for allowing the passage of a prop 706 having a diameter d.On the other hand, the positioning bar in the Y direction 710 is amember fixed in combination at the right angle with the positioning barin the X direction 709 described above, and include similarly notches802 and holes 801 at a pitch P. Here, the notches 802 are cut out on theopposite side (upper side). Incidentally, the dimensions of all thenotches 792 and 802 formed on the positioning bars 709 and 710 and allthe notches 771 and 781 formed on the ribbon-shaped films 707 and 708are the same.

FIG. 42 is a perspective view showing the assembled state of thepositioning bar in the X direction 709 and the positioning bar in the Ydirection 710 at the crossing point. Both the positioning bar in the Xdirection 709 and the positioning bar in the Y direction 710 arepositioned in the X-Y directions by passing the prop 706 through theholes 791 and 801, and are positioned in the Z direction with the lowerends entering into contact with a stepped part 761 of the prop 706. Theinterval g formed then is filled with ribbon-shaped films. Incidentally,these positioning bars 709 and 710 play the role of a reinforcing memberconstituting the multiple array probe assembly together with the prop706 in addition to their positioning function.

FIG. 37 is a top plan view showing the state of the positioning bar inthe X direction 709 and the positioning bar in the Y direction 710described above as well as the ribbon-shaped films 707 and 708 mountedon a multiple array mounting stand. By the fixation of these components,the ribbon-shaped films 707 and 708 having contact terminals 775 and 785for entering into contact with the vertical probes of separate probeassemblies are positioned and fixed on the four sides of the pedestal703, and electric signals can be taken out through the copper wiringlines 772 and 782 of the ribbon-shaped films 707 and 708. Therefore,they can demonstrate fully their functions as a multiple array probeassembly.

The following is a description of the process of fixing the positioningbars 709 and 710 as well as the ribbon-shaped films 707 and 708 shown inFIG. 43 with reference to the illustration of process in FIGS. 44A to44D. It should be noted that this process is only an example and thatthe work may be carried out by going through other processes. To beginwith, as shown in FIG. 43A, the prop 706 is passed through the hole 801by keeping the notch 802 of the positioning bar in the Y direction 710upside, and the positioning bar 710 in the Y direction is fitted betweenthe pedestals 703 and 703. At this moment, the positioning bar in the Ydirection 710 is positioned in the Y direction by the prop 706 and atthe same time it is positioned in the Z direction with the lower partbeing in contact with the stepped part 761 of the prop 706. At thismoment, a gap g is formed between the pedestal 3 and the positioning barin the Y direction 710 on both sides thereof.

Then, as shown in FIG. 43B, the ribbon-shaped films in the Y direction708 are vertically fitted into the gap g on both sides one after anotherin the longitudinal direction. At the time of insertion, the notches 781are kept facing upward and the vertical copper wiring lines 782 areinserted towards the side surface of the pedestal 703. At this moment,as the notches 781 of the ribbon-shaped film 708 have the samedimensions as the notches 802 of the positioning bars 710, they arepositioned in the Y direction by matching the position of the respectivenotches. Or the ribbon-shaped films may be positioned and superposed inadvance on the positioning bar 710, and at the time of fixing thepositioning bar 710 they may be integrated and fitted together.Simultaneously upon the insertion, the lower side of the ribbon-shapedfilm 708 comes into contact with the stepped part 761 of the prop 706resulting in their positioning in the Z direction, the position of theupper end of the film 708 matching the position of the upper surface ofthe pedestal 703. The top of the probe of the probe assembly 701 fixedon the pedestal 703 and the contact terminal 785 of the vertical copperwiring lines 782 of the ribbon-shaped film 708 will match mutually.

After the fixing operation of the positioning bar in the Y direction 710and the ribbon-shaped film 708 has ended in this way, as shown in FIG.43C this time, the prop 706 is passed through the hole 791 by keepingthe notches 792 of the positioning bar in the X direction 709 downward,and the positioning bar in the X direction 709 is fixed into thepedestal 703 and 703. At this moment, the positioning bar in the Xdirection 709 is positioned in the X direction by the prop 706 and atthe same time it is positioned in the Z direction with its lower partbeing in contact with the stepped part 761 of the prop 709. As a result,the positioning bars 710 and 709 are fixed between the pedestal 703 andthe pedestal 703 with their notches 802 and 792 being combinedrespectively in a grid form. At this moment, a gap g is formed betweenthe positioning bar in X direction 709 and the pedestal 703 on bothsides of the positioning bar 709.

Then, as shown in FIG. 43D, the gaps g on both sides are filledvertically with the ribbon-shaped films in the X direction 707 one afteranother while being kept in the longitudinal direction. At the time ofinsertion, the ribbon-shaped films in the X direction 707 are insertedwith the notches 771 facing downward and the vertical copper wiringlines 772 directed towards the side surface of the pedestal 703. At thismoment, the ribbon-shaped films 707 are combined with the notches 802 ofthe positioning bar 710 on which notches 771 have already been cut outand with the notches 781 of the ribbon-shaped films 708, and are fixedin the grid form for their positioning in the X direction. At the sametime, the lower side of the film is in contact with the stepped part 761of the prop 706 for their positioning in the Z direction. This causesthe position of the upper end of the film 7 to agree with the positionof the upper surface of the pedestal 703. This also causes the top ofvertical probes of the probe assembly 701 fixed on the pedestal 703 andthe contact terminals 775 of the vertical copper wiring lines 772 of theribbon-shaped films 707 agree respectively.

Thus, the electric wiring structure of the multiple array probe assemblyin the present invention can be easily assembled with a high precisionby combing the ribbon-shaped films having the common wiring line in theform of a grid pattern. Due to a plurality of connecting terminals forcopper wiring lines respectively being brought into contact and fixed atthe right position on each side of the pedestal in a stroke, there is noneed to adjust the height and parallelism of connecting terminals lateron.

Embodiment 11

The following is a detailed description of Embodiment 11 of the presentinvention with reference to drawings. The present Embodiment 11 isadapted to multiple wiring lines and to realize higher speed as a partof the system of the present invention already described in FIG. 4. FIG.50 is a perspective view of the present Embodiment 11. For example,probes are brought into contact en bloc with pads arranged on thememory-related line for high-speed tests.

In FIG. 50, the code 602 represents a pad. There are two adjacent linesand as shown in the figure the pads are arranged in two lines at a fixedinterval. The present Embodiment 11 takes an example of two adjacentlines. However, when any one of the opposite probes 603 described aboveis missing, a linear arrangement of equal interval will remain.

The code 709-1 represents a positioning bar in the X direction, and710-1 represents a positioning bar in the Y direction. In Embodiment 9,the form and functions of the positioning bar in the X direction 709 andthe positioning bar in the Y direction 710 are described, and thepositioning bar in the X direction 709-1 and the positioning bar in theY direction 710-1 in the present Embodiment have nearly same forms andfunctions. The positioning bar in the X direction 709-1 and thepositioning bar in the Y direction 710-1 are mutually acting as a meansof securing a precise positioning. A plurality of probes 603-1 arearranged in the Y direction and multiple layers of the same are arrangedin the thickness direction (X direction). In reality, however, theground line pattern 604-1 and the electric conductive part 606-3 areformed and arranged by etching, plating based on the lithography andother processing means on the film 605-1 which is a film-shapedinsulating coating as described above. The code 110 is a one-axis testcircuit.

FIG. 51 is an enlargement of the main part of FIG. 50. Two sets ofone-axis testing circuits 110 are solidly pasted on the side surface ofthe positioning bar in the X direction 709-1. FIG. 52 is a front view ofthe one-axis test circuit 110. Each one-axis test circuit consists of aflexible film 111, an electronic device 112, a connecting wiring line113 and an input-output line 114.

The flexible film 111 is made of a material of the same substance as theribbon-shaped film 707 in Embodiment 8, and connecting wiring lines 113play nearly the same role of electric connecting with probes as thecopper wiring line 772. The electronic device 112 receives the testinformation coming from the general-purpose computer described in FIG. 4above from the interface 75 and transmits the same to the connectingline 113. The electronic device 112, capable of securing necessary spacein the vertical direction on the paper surface, can be arranged in sucha way that a testing circuit may exist for a chip. FIG. 52 describesthat two electronic devices 112 are connected with pads 602 on chipsthrough the connecting wiring lines 113. However, actually one of aplurality of electronic devices 112 is connected with pads 602 on a chipsubstantially through the connecting wiring lines 113 described above.

FIG. 53 is a view as seen from the arrow X direction of FIG. 50. FIG. 54is a view as seen from the arrow Y direction of FIG. 50. In FIG. 51 andFIG. 53, a fixing pin 109 is inserted with pressure in a hole 791-1 cutout in the positioning bar in the X direction 709-1, and a round bar 109is pinched and fixed between the collar of the fixing pin 109 and an endof the convex part of the positioning bar in the X direction 709-1. Inthe present Embodiment, the round bar 109 is arranged from one straightline direction (in this case, only from the X direction). In theembodiment described below, it will be arranged from the X and Ydirections.

In FIG. 54, the connecting wiring line 113 protrudes slightly from theflexible film 111 and realizes an electric connection with an outputdeforming part 610-1. Notches 115 are cut out in order to avoidinterference with the positioning bar in the X direction 709-1.

As described above, the present Embodiment 11 enables to build up anon-serial testing, simultaneous, en bloc and high-speed wafer testingsystem capable of transmitting and receiving testing signal directly toand from the testing circuits of all the pads of all the chips arrangedon a wafer by maintaining the relationship of correspondence of one chipto one testing circuit.

Embodiment 12

The following is a detailed description of Embodiment 12 of the presentinvention with reference to drawings. The present Embodiment 12 isadapted to multiple wiring lines and to realize higher speed as a partof the system of the present invention already described in FIG. 4. FIG.55 is a perspective view of the present Embodiment 12. For example,probes are brought into contact en bloc with pads arranged in therectangular form such as logic-related ACIC and the like for high-speedtests.

In FIG. 55, the code 601 represents chips, 602 represents pads, and thechips 601 are arranged in multiple grid form on a wafer. The code 709-1represents a positioning bar in the X direction, and 710-1 represents apositioning bar in the Y direction. In Embodiment 9, the form andfunctions of the positioning bar in the X direction 709 and thepositioning bar in the Y direction 710 are described, and thepositioning bar in the X direction 709-1 and the positioning bar in theY direction 710-1 in the present Embodiment 12 have nearly same formsand functions. The positioning bar in the X direction 709-1 and thepositioning bar in the Y direction 710-1 are mutually acting as a meansof securing a precise positioning. A plurality of probes 603-1 arearranged in the Y direction and multiple layers of the same are arrangedin the thickness direction (X direction). In reality, however, theground line pattern 604-1 and the electric conductive part 606-3 areformed and arranged by etching, plating based on the lithography andother processing means on the film 605-1 which is a film-shapedinsulating coating as described above.

The code 110 represents a one-axis testing circuit. Probes 603-2 arearranged in the Y direction and the X direction as shown in the figurelike the probes 603-1 so that they may cross at the right angle with theprobes 603-1. They are produced according to the method described inFIG. 26 and FIG. 27 on the method for avoiding the interference betweenthe probes 603-1 and the probes 603-2.

Two sets of one-axis testing circuits 110 are solidly pasted on bothsides of the positioning bar in the X direction 709-1. Similarly twosets of two-axis testing circuits 116 are solidly pasted on both sidesof the positioning bar in the Y direction 710-1. The two-axis testingcircuit 116 is provided with notches 120 in order to avoid interferencebetween the one-axis testing circuit 110 and the two-axis testingcircuit. The one-axis testing circuit 110 is fixed by passing throughthis notch. FIG. 56 is a front view of the two-axis testing circuit 116,As FIG. 56 shows, the two-axis testing circuit consists of two flexiblefilms 117, an electronic device 112, two-connecting wiring lines 118,two input-output lines 119 and notches 120.

The two-flexible films 117 are made of a material of the same substanceas the ribbon-shaped film 707 in Embodiment 8, and the two-connectingwiring lines 118 plays nearly the same role of electric connecting withprobes as the copper wiring line 772 and the connecting wiring lines113. The electronic device 112 receives the test information coming fromthe general-purpose computer described in FIG. 4 from the interface 75and transmits the same to the connecting line 118. The electronic device112, capable of securing necessary space in the vertical direction onthe paper surface, can be arranged in such a way that a testing circuitmay exist for a chip. FIG. 52 describes that two electronic devices 112are connected with the pads 602 on chips through the connecting wiringlines 113. However, actually one of a plurality of electronic devices112 is connected with the pads 602 on a chip substantially through thetwo-connecting wiring lines 118 described above.

The main difference between the one-axis testing circuit 110 and thetwo-axis testing circuit is that the two-notch 120 is larger than thenotch 115 in order to avoid interference with the electronic device 112.It is also that because of the larger notch, the width through which thetwo-connecting wire lines 118 pass is narrower. In the presentEmbodiment 12, as shown in FIG. 56, the part that has become narrow isdealt with by wiring on both sides of the two-flexible film so that thetotal sum of wiring lines on the surface and the wiring lines on theback may be equal to the total sum of the wiring lines outputted fromthe electronic device 112.

FIG. 57 is a view as seen from the arrow X direction of FIG. 50. FIG. 58is a view as seen from the arrow Y direction of FIG. 50. In FIGS. 55, 57and 58, a fixing pin 109 is inserted with pressure into a hole 791-1 cutout in the positioning bar in the X direction 709-1, and the round bar109 is pinched and fixed between the collar of the fixing pin 109 and anend of the convex part of the positioning bar in the X direction 709-1.In the case of the present Embodiment 12, the round bar 109 is arrangedfrom two straight line direction (in this case, only from the Xdirection and the Y direction). The two-connecting wiring lines 118protrude slightly from the two-flexible film 117 and realizes electricconnection with the output deforming part 610-1.

As described above, the present Embodiment 12 enables to build up anon-serial testing, simultaneous, en bloc and high-speed wafer testingsystem capable of transmitting and receiving directly to and from thetesting circuits of all the pads of all the chips arranged in arectangular form on a wafer by maintaining the relationship ofcorrespondence of one chip to one testing circuit.

According to the present invention, fine vertical probes and wiringpatterns can be easily processed by etching a generally used copper foillaminated resin film, and a multiple array vertical probe assembly canbe easily made by combining in the grid form in the X and Y directionsthese units made by arranging a plurality of the resin films cut out inthe ribbon shape. In this way, it will be possible to measure by probingen bloc multiple chips formed on a semiconductor wafer of a largediameter, and significant contribution can be foreseen in the field ofsemiconductor field with more emphasis on miniaturization as higherintegration of IC chips progresses.

The present invention has been described on the basis of preferableembodiments shown in figures. However, it is obvious that any oneskilled in the art can easily change or modify the present invention,and such changed or modified parts are included in the scope of thepresent invention. In particular, the present invention is effectivewhen it is used for testing the circuit of a plurality of semiconductorchips formed on a semiconductor wafer in the manufacturing process ofLSI and other similar electronic devices. In addition, the presentinvention can be used for testing the function of electronic functionalelements including the circuit of a large variety of electronic devicesincluding liquid crystals and the like.

1. A probing device for establishing electric connection between atesting device and a plurality of semiconductor chips to be testedformed on a semiconductor wafer through probes by bringing the probesinto contact with the semiconductor chips to be tested, each of thechips comprising one or more pads, the device comprising: a plurality ofsets of units in an X direction and of units in a Y direction comprisinga plurality of ribbon-like resin films comprising a plurality of probeslaid out together in the probing device, each probe comprising a curvedpart; wherein the plurality of sets of units in the X direction andunits in the Y direction are arranged in a grid form on a supportingboard to be positioned and fixed there, and the probes positioned ateach crossing of the units in the X direction and the units in the Ydirection are brought into contact en bloc with all the pads of thechips to be tested formed on a semiconductor wafer to carry out probingtests; and wherein said ribbon-shaped film in the Y direction isarranged in such a way that an end of the probe protrude from the upperside of the curved part in the longitudinal direction, the other endtails down from the lower side of the curved part and extends to the endof the ribbon-shaped film to form a wiring line, a length of protrusionof the probe is formed longer than a length of protrusion in saidribbon-shaped film in the X direction, while the resin film part has anopening cut out being encircled by the curved part.
 2. The probingdevice according to claim 1, wherein crossing positions of the pluralityof sets of units in the X direction and units in the Y direction wheresaid probes are arranged correspond one to one with all thesemiconductor chips to be tested formed on a semiconductor wafer, andthe ribbon-shaped film in the X direction and the ribbon-shaped resinfilm in the Y direction occupy exclusive spaces at the crossingpositions and do not interfere among themselves.
 3. The probing deviceaccording to claim 1, wherein an arrangement of said probes arranged ateach crossing position of said units in the X direction and units in theY direction is supported by fixing means, and a pad arrangement of eachsemiconductor chip to be tested and the top of the probes agree.
 4. Theprobing device according to claim 1, wherein said ribbon-shaped resinfilm comprises a ribbon-shaped film in the X direction and aribbon-shaped film in the Y direction, respectively formed by a probehaving a curved part created on a copper foil laminated resin film and awiring line pattern connected thereto by etching.
 5. The probing deviceaccording to claim 4, wherein a plurality of resiliently deformablecontact terminals are provided for each wiring line.
 6. The probingdevice according to claim 1, wherein said ribbon-shaped resin film isarranged in such a way that curved parts of adjacent probes may face inan opposite direction.
 7. The probing device according to claim 1,wherein said ribbon-shaped film in the X direction is arranged in such away that an end of the probe protrudes from an upper side of the curvedpart in a longitudinal direction, and another end tails down from thelower side of the curved part and extends to an end of the ribbon-shapedfilm to form a wiring line, while the resin film part has a secondopening cut out being encircled by the curved part and a second openingcut out at equal intervals in the longitudinal direction for allowingthe ribbon-shaped film in the Y direction to pass at the right angle. 8.The probing device according to claim 1, further comprising a pluralityof square bars for supporting an arrangement of said probes arranged ateach crossing position of said units in the X direction and units in theY direction, at least one square bar comprising a convex protrusionarranged on a surface thereof, and wherein a position at which a surfacein a thickness direction of the convex protrusion arranged on thesurface of the at least one square bar and the ribbon-shaped films inthe X direction or the ribbon-shaped films in the Y direction come intocontact in order to precisely determine the position in the thicknessdirection of the ribbon-shaped film in the X direction and theribbon-shaped film in the Y direction is a position at a limit ofshiftability of the films.
 9. A probing device for establishing electricconnection between a testing device and a plurality of semiconductorchips to be tested formed on a semiconductor wafer through probes bybringing the probes into contact with the semiconductor chips to betested, each of the chips comprising one or more pads, the devicecomprising: a plurality of sets of units in an X direction and of unitsin a Y direction comprising a plurality of ribbon-like resin filmscomprising a plurality of probes laid out together in the probingdevice, each probe comprising a curved part; wherein the plurality ofsets of units in the X direction and units in the Y direction arearranged in a grid form on a supporting board to be positioned and fixedthere, and the probes positioned at each crossing of the units in the Xdirection and the units in the Y direction are brought into contact enbloc with all the pads of the chips to be tested formed on asemiconductor wafer to carry out probing tests; wherein saidribbon-shaped film in the X direction is arranged in such a way that anend of the probe protrudes from an upper side of the curved part in alongitudinal direction, and another end tails down from the lower sideof the curved part and extends to an end of the ribbon-shaped film toform a wiring line, while the resin film part has a first opening cutout being encircled by the curved part and a second opening cut out atequal intervals in the longitudinal direction for allowing theribbon-shaped film in the Y direction to pass at the right angle; andwherein said ribbon-shaped films in the X and Y directions have springrestoring force in an axis direction of the probes by resilientdeformation of a narrow width part of the resin film formed by theopening encircled by said curved part and the upper side of the resinfilm at the time of a test.
 10. The probing device according to claim 9,wherein the unit in the Y direction passes at the right angle throughthe second opening of the unit in the X direction, the curved part ofthe unit in the X direction and the curved part of the unit in the Ydirection are arranged having a difference in phase without interferencein the Z axis direction, and wherein the probing device furthercomprises square bars for supporting the respective curved parts crossat the right angle having a difference in phase in the Z axis direction,and said respective square bars are at an equal distance from adjacentsemiconductor chips to be tested.
 11. A probing device for establishingelectric connection between a testing device and a plurality ofsemiconductor chips to be tested formed on a semiconductor wafer throughprobes by bringing the probes into contact with the semiconductor chipsto be tested, each of the chips comprising one or more pads, the devicecomprising: a plurality of sets of units in an X direction and of unitsin a Y direction comprising a plurality of ribbon-like resin filmscomprising a plurality of probes laid out together in the probingdevice; wherein the plurality of sets of units in the X direction andunits in the Y direction are arranged in a grid form on a supportingboard to be positioned and fixed there, and the probes positioned ateach crossing of the units in the X direction and the units in the Ydirection are brought into contact en bloc with all the pads of thechips to be tested formed on a semiconductor wafer to carry out probingtests; and wherein said units in the X direction and units in the Ydirection are erected being arranged in a matrix form on the supportingboard and are arranged on a plurality of props for positioning in the Xdirection and the Y direction linked with fixing means.
 12. The probingdevice according to claim 11, wherein each of the probes comprises acurved part, and wherein said unit in the X direction and unit in the Ydirection are arranged at the right angle having a difference in phasein a Z axis direction without interference, the curved part in the unitin the X direction and the curved part in the unit in the Y directionare arranged having a difference in phase in the Z axis directionwithout interference, the fixing means comprising a means of supportingthe respective curved parts cross at the right angle having a differencein phase in the Z axis direction, and said respective square bars are atan equal distance from adjacent semiconductor chips to be tested.